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參數(shù)資料
| 型號(hào)： | AE312RAG12NGSW |
| 廠商： | COILCRAFT INC |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0603 |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 223K |
| 代理商： | AE312RAG12NGSW |
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cp@coilcraft.com
www.coilcraft-cps.com
Coilcraft, Inc. 2009
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
AerospaceGradeChipInductors AE312RAG
0603 CHIP INDUCTORS
Document AE537-1
Revised 07/16/09
0
20
40
60
80
100
120
140
160
10
100
10000
1000
Q
F
actor
Frequency (MHz)
10 nH
150 nH
330 nH
24 nH
51 nH
82 nH
Typical Q vs Frequency
Typical L vs Frequency
1
10
100
1000
10
100
10000
1000
Inductance
(nH)
Frequency (MHz)
150 nH
330 nH
10 nH
24 nH
51 nH
82 nH
A
B
overall
C
D
I
J
F
G
H
E
terminal
Terminal wraparound:
approx 0.01/0,24 both ends
Suggested
Land Pattern
AB
C
max
min –max
max
D
E
F
G
H
I
J
0.069 0.034 – 0.043 0.034 0.015 0.029 0.013 0.038 0.040 0.027 0.028 inches
1,75
0,86 – 1,09
0,86
0,38
0,33
0,96
1,02
0,69 0,71 mm
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature –55°C to +125°C with
Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7
″ reel.
Paper tape: 8 mm wide, 1 mm thick, 4 mm pocket spacing
Current Derating
-40
-55
-20
0
20
40
60
80
100
160
140
120
Ambient temperature (°C)
P
e
rcent
of
rated
rmsI
120
110
100
90
80
70
60
50
40
30
20
10
0
25°C
■ Higher Q and lower DCR than other 0603 inductors
■ Highest SRF values – as high as 16 GHz
■ Excellent current handling capability – up to 2100 mA
■ High temperature materials allow operation in ambient
temperatures up to 155°C.
■ Passes NASA low outgassing specifications
■ Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
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