參數(shù)資料
型號： AE235RAL5N8XJSH
廠商： COILCRAFT INC
元件分類： 通用定值電感
英文描述： 1 ELEMENT, 0.0058 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
封裝： CHIP, 0402
文件頁數(shù)： 1/2頁
文件大?。?/td> 216K
代理商： AE235RAL5N8XJSH
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cp@coilcraft.com
www.coilcraft-cps.com
Coilcraft, Inc. 2009
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
Aerospace Grade Chip Inductors
AE235RAL
0402 CHIP INDUCTORS
Document AE347-1
Revised 06/02/09
Inductance
2
(nH)
0.78
1.9
3.4
3.5
5.8
6.2
8.2
Percent
tolerance
5
5,2
5,2
5,2
5,2
5,2
5,2
900 MHz
L typ
0.79
1.83
3.36
3.51
5.76
6.17
8.15
1.7 GHz
L typ
0.76
1.81
3.33
3.55
5.70
6.28
8.19
SRF min
4
(MHz)
16300
13200
10000
9500
4900
4900
4100
DCR typ
5
(Ohms)
0.018
0.022
0.030
0.040
0.045
0.055
0.060
I
max
(mA)
1860
1700
1500
1400
1300
1150
1100
Part number
1
AE235RAL0N8XJSZ
AE235RAL1N9X_SZ
AE235RAL3N4X_SZ
AE235RAL3N5X_SZ
AE235RAL5N8X_SZ
AE235RAL6N2X_SZ
AE235RAL8N2X_SZ
Q typ
3
35
50
51
58
56
57
58
Q typ
3
55
73
93
82
83
81
82
1. When ordering, specify
tolerance
and
testing
codes:
AE235RAL8N2X
G
S
Z
G
=2%
J
= 5%
Z
=Coilcraft Critical Products Environmental Stress
Conditions Testing.
H
=Coilcraft Qual + Coilcraft Hi-Rel Burn-in
P
=Coilcraft Qual + MIL-STD-981 Class S Group A
screening
N
=Coilcraft Qual + MIL-STD-981 Class B Group A
screening
C
=Coilcraft Qual + MIL-STD-981 Class S Group A
screening + MIL-STD-981 Class S Group B
qualification
W
=Coilcraft Qual + MIL-STD-981 Class B Group A
screening + MIL-STD-981 Class S Group B
qualification
2. Inductance measured at 250 MHz using a Coilcraft SMD-F test fixture
and Coilcraft-provided correlation pieces with an Agilent/HP 4286
impedance analyzer.
3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test
fixture.
4. For SRF >6 GHz, measured using an Agilent/HP 8722ES network
analyzer and a Coilcraft SMD-D test fixture. For SRF
≤
6 GHz, measured
using anAgilent/HP 8753D network analyzer and a Coilcraft SMD-D test
fixture.
5. DCR measured on a micro-ohmmeter.
6. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Tolerance:
Testing:
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
I
max current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing,
2000/7
″
reel
■
High current ratings – up to 1.8 A
■
Ideal for power amplifiers in TDMA, CDMA, GSM and
other wireless applications
■
Perfect for use as an RF choke for the power supply, the
LC tank between amplifier and antenna and in the
amplifier bias circuit.
■
Excellent Q factors
■
Outstanding self-resonant frequency
■
Tight inductance tolerance
■
High temperature materials allow operation in ambient
temperatures up to 155°C.
■
Passes NASA low outgassing specifications
■
Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
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