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REV. A
–12–
ADV7302A/ADV7303A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADV7302A/ADV7303A features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
*
V
AA
to AGND . . . . . . . . . . . . . . . . . . . . . . . . +3.0 V to –0.3 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . +3.0 V to –0.3 V
V
DD_IO
to IO_GND . . . . . . . . . . . . . –0.3 V to V
DD_IO
+ 0.3 V
Ambient Operating Temperature (T
A
) . . . . . . . 0
°
C to +70
°
C
Storage Temperature (T
S
) . . . . . . . . . . . . . . –65
°
C to +150
°
C
Infrared Reflow Soldering (20 sec) . . . . . . . . . . . . . . . . 260
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
TOP VIEW
(Not to Scale)
V
DD_IO
GND_IO
GND_IO
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
C
31
R
30
C
29
C
28
C
27
C
26
C
25
P
24
P
23
P
22
S
21
S
20
A
19
I
2
C
18
C
17
C
Y0
Y1
Y2
Y3
Y4
Y5
V
DD
DGND
Y6
Y7
GND_IO
GND_IO
C0
S_BLANK
R
SET1
V
REF
COMP1
DAC A
DAC B
DAC C
V
AA
AGND
DAC D
DAC E
DAC F
COMP2
R
SET2
EXT_LF
RESET
G
C
S
S
S
S
S
D
V
D
S
S
S
G
G
S
S
ADV7302A/ADV7303A
The ADV7302A/ADV7303A is a lead-free environmentally
friendly product. It is manufactured using the most up-to-date
materials and processes. The coating on the leads of each device
is 100% pure tin electroplate. The device is suitable for lead-free
applications and is able to withstand surface-mount soldering at
up to 255
°
C (
±
5
°
C). In addition, it is backward compatible with
conventional tin-lead soldering processes. This means that the
electroplated tin coating can be soldered with tin-lead solder
pastes at conventional reflow temperatures of 220
°
C to 235
°
C.
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Input/Output
Function
1
4–9, 12, 13
V
DD_IO
Y0–Y7
P
I
Power Supply for Digital Inputs and Outputs
8-Bit Progressive Scan/HDTV Input Port for Y Data. The LSBs are set up on
Pins Y0 and Y1. In default mode, the input on this port is output on DAC D.
8-Bit Progressive Scan/HDTV Input Port for CrCb Color Data in 4:2:2 Input
Mode. In 4:4:4 Input Mode, this input port is used for the Cb (Blue/U) data.
The LSBs are set up on Pins C0 and C1. In default mode, the input on this
port is output on DAC E.
16–18, 26–30
C0–C7
I
ORDERING GUIDE
Model
Package Description
Package Option
ADV7302AKST
ADV7303AKST
Plastic Quad Flatpack
Plastic Quad Flatpack
ST-64B
ST-64B
THERMAL CHARACTERISTICS
θ
JC
= 11
°
C/W
θ
JA
= 47
°
C/W