參數(shù)資料
型號(hào)： ADUC841BCP62-3
廠(chǎng)商： ANALOG DEVICES INC
元件分類(lèi)： 微控制器/微處理器
英文描述： MicroConverter 12-Bit ADCs and DACs with Embedded High Speed 62-kB Flash MCU
中文描述： 8-BIT, FLASH, 8.38 MHz, MICROCONTROLLER, QCC56
封裝： 8 X 8 MM, LEAD FRAME, MO-220VLLD2, CSP-56
文件頁(yè)數(shù)： 75/88頁(yè)
文件大?。?/td> 903K
代理商： ADUC841BCP62-3
ADuC841/ADuC842/ADuC843
5 V Part
For DV
DD
below 4.5 V, the internal POR holds the part in reset.
As DV
DD
rises above 4.5 V, an internal timer times out for
approximately 128 ms before the part is released from reset. The
user must ensure that the power supply has reached a stable
4.75 V minimum level by this time. Likewise on power-down,
the internal POR holds the part in reset until the power supply
has dropped below 1 V. Figure 83 illustrates the operation of the
internal POR in detail.
Rev. 0 | Page 75 of 88
128ms
1.0V
128ms
4.75V
1.0V TYP
INTERNAL
CORE RESET
DV
DD
0
Figure 83. Internal POR Operation
Grounding and Board Layout Recommendations
As with all high resolution data converters, special attention
must be paid to grounding and PC board layout of ADuC841/
ADuC842/ADuC843 based designs to achieve optimum
performance from the ADC and the DACs. Although the parts
have separate pins for analog and digital ground (AGND and
DGND), the user must not tie these to two separate ground
planes unless the two ground planes are connected together
very close to the part, as illustrated in the simplified example of
Figure 84a. In systems where digital and analog ground planes
are connected together somewhere else (for example, at the
system’s power supply), they cannot be connected again near the
part since a ground loop would result. In these cases, tie all the
part’s AGND and DGND pins to the analog ground plane, as
illustrated in Figure 84b. In systems with only one ground plane,
ensure that the digital and analog components are physically
separated onto separate halves of the board such that digital
return currents do not flow near analog circuitry and vice versa.
The part can then be placed between the digital and analog
sections, as illustrated in Figure 84c.
In all of these scenarios, and in more complicated real-life
applications, keep in mind the flow of current from the supplies
and back to ground. Make sure the return paths for all currents
are as close as possible to the paths that the currents took to
reach their destinations. For example, do not power components
on the analog side of Figure 84b with DV
DD
since that would
force return currents from DV
DD
to flow through AGND. Also,
try to avoid digital currents flowing under analog circuitry,
which could happen if the user places a noisy digital chip on the
left half of the board in Figure 84c. Whenever possible, avoid
large discontinuities in the ground plane(s) (like those formed
by a long trace on the same layer), since they force return
signals to travel a longer path. And of course, make all connec-
tions to the ground plane directly, with little or no trace
separating the pin from its via to ground.
If the user plans to connect fast logic signals (rise/fall time <
5 ns) to any of the part’s digital inputs, a series resistor should be
added to each relevant line to keep rise and fall times longer
than 5 ns at the part’s input pins. A value of 100
or 200
is
usually sufficient to prevent high speed signals from coupling
capacitively into the part and from affecting the accuracy of
ADC conversions.
DGND
AGND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
GND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
DGND
a.
AGND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
b.
c.
0
Figure 84. System Grounding Schemes
相關(guān)PDF資料
PDF描述
ADUC841BCP62-5 Cable Gland (Clamp); Connector Shell Size:10SL, 12S; Thread Size:5/8-24; Approval Categories:MIL-C-5015; Series:97 RoHS Compliant: Yes
ADUC841BCP8-3 10-823955-004
ADUC841BCP8-5 Cable Gland (Clamp); Connector Shell Size:14, 14S; Thread Size:3/4-20; Body Material:Zinc Alloy
ADUC841BS62-3 MicroConverter 12-Bit ADCs and DACs with Embedded High Speed 62-kB Flash MCU
ADUC841BS62-5 MicroConverter 12-Bit ADCs and DACs with Embedded High Speed 62-kB Flash MCU
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADUC841BCP62-5 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 5V 56-Pin LFCSP EP
ADUC841BCP8-3 制造商:Analog Devices 功能描述:MCU 8-bit ADuC8xx 8052 CISC 62KB Flash 3V 56-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述:8BIT CISC 62KB FLASH 20MHZ 3.3V 56LFCSP - Bulk
ADUC841BCP8-5 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:MicroConverter 12-Bit ADCs and DACs with Embedded High Speed 62-kB Flash MCU
ADUC841BCPZ62-3 功能描述:IC MCU 62K FLASH ADC/DAC 56LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:4KB（4K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱(chēng):269-4116Z8F0413SH005EG-ND
ADUC841BCPZ62-5 功能描述:IC MCU 62K FLASH ADC/DAC 56LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:4KB（4K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱(chēng):269-4116Z8F0413SH005EG-ND
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