參數(shù)資料
型號: ADSP-21363
廠商: Analog Devices, Inc.
英文描述: SHARC Processor
中文描述: SHARC處理器
文件頁數(shù): 44/44頁
文件大小: 396K
代理商: ADSP-21363
Rev. PrA
|
Page 44 of 44
|
September 2004
ADSP-21363
Preliminary Technical Data
2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
ORDERING GUIDE
Figure 36. 136-Ball Mini-BGA (BC-136-2)
Part Number
1,
2,
3
1
Z indicates Lead Free package. For more information about lead free package offerings, please visit www.analog.com.
2
See
Thermal Characteristics on Page 37
for information on package thermal specifications.
3
See Engineer–to–Engineer Note TBD for further information.
4
PCB must have thermal vias. See
Thermal Characteristics on Page 37
. For more information see JEDEC Standard JESD51-9.
5
Heat slug must be soldered to the PCB. See
Thermal Characteristics on Page 37
. For more information see JEDEC Standard JESD51-5.
Ambient
Temperature
Range
°
C
0 to 70
0 to 70
0 to 70
0 to 70
–40 to 85
–40 to 85
–40 to 85
–40 to 85
–40 to 105
–40 to 105
Instruction
Rate
On-Chip
SRAM
ROM
Operating Voltage
Internal/External
Volts
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.0/3.3
1.0/3.3
Package
ADSP-21363SKBCZENG
ADSP-21363SKBC-ENG
ADSP-21363SKSQZENG
ADSP-21363SKSQ-ENG
ADSP-21363SBBCZENG
4
ADSP-21363SBBC-ENG
4
ADSP-21363SBSQZENG
5
ADSP-21363SBSQ-ENG
5
ADSP-21363SCSQZENG
5
ADSP-21363SCSQ-ENG
5
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
200MHz
200MHz
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
SEATING
PLANE
0.25
MIN
DETAIL A
0.50
0.45
0.40
(BALL
DIAMETER)
DETAIL A
1.70
MAX
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 MM OF ITSIDEAL POSITION RELATIVE
TOTHEPACKAGEEDGES.
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.08 MM
OF ITSIDEAL POSITION RELATIVETOTHE BALL GRID.
4. COMPLIANT TOJEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
5. CENTER DIMENSIONS ARE NOMINAL.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
10 9 8 7 6 5 4 3 2 1
13
14
11
12
TYP
10.40 BSC SQ
PIN A1 INDICATOR
BOTTOM VIEW
TOP VIEW
12.00 BSC SQ
0.12MAX (BALL
COPLANARITY)
0.80
BSC
0.80
BSC
TYP
相關(guān)PDF資料
PDF描述
ADSP-21363SBBC-ENG SHARC Processor
ADSP-21363SBBCZENG SHARC Processor
ADSP-21364 SHARC Processor
ADSP-21364SBBC-ENG SHARC Processor
ADSP-21364SBBCZENG SHARC Processor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21363BBC-1AA 功能描述:IC DSP 32BIT 333MHZ 136-CSPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21363BBCZ1AA 制造商:Analog Devices 功能描述:- Trays
ADSP-21363BBCZ-1AA 功能描述:IC DSP 32BIT 333MHZ 136CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C,McASP,McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
adsp-21363bsqz-1aa 制造商:Analog Devices 功能描述:
ADSP-21363BSWZ-1AA 功能描述:IC DSP 32BIT 333MHZ EPAD 144LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C,McASP,McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA