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RECOMMENDEDOPERATINGCONDITIONS
Min
K Grade
Parameter
Max
Unit
V
DD
T
AMB
Supply Voltage
Ambient Operating T emperature
4.50
0
5.50
+70
V
°
C
See “Environmental Conditions” for information on thermal specifications.
ELECTRICAL CHARACTERISTICS
Parameter
T est Conditions
Min
Max
Unit
V
IH
V
IH
V
IL
V
OH
Hi-Level Input Voltage
3, 5
Hi-Level CLK IN Voltage
Lo-Level Input Voltage
1, 3
Hi-Level Output Voltage
2, 3, 7
@ V
DD
= max
@ V
DD
= max
@ V
DD
= min
@ V
DD
= min, I
OH
= –0.5 mA
@ V
DD
= min, I
OH
= –100
μ
A
8
@ V
DD
= min, I
OL
= 2 mA
@ V
DD
= max, V
IN
= V
DD
max
@ V
DD
= max, V
IN
= 0 V
@ V
DD
= max, V
IN
= V
DD
max
6
@ V
DD
= max, V
IN
= 0 V
6
@ V
IN
= 2.5 V, f
IN
= 1.0 MHz, T
AMB
= 25
°
C
@ V
IN
= 2.5 V, f
IN
= 1.0 MHz, T
AMB
= 25
°
C
2.0
2.2
V
V
V
V
V
V
μ
A
μ
A
μ
A
μ
A
pF
pF
0.8
2.4
V
DD
– 0.3
V
OL
I
IH
I
IL
I
OZH
I
OZL
C
I
C
O
Lo-Level Output Voltage
2, 3, 7
Hi-Level Input Current
1
Lo-Level Input Current
1
T hree-State Leakage Current
4
T hree-State Leakage Current
4
Input Pin Capacitance
1, 8, 9
Output Pin Capacitance
4, 8, 9, 10
0.4
10
10
10
10
8
8
NOT ES
Input-only pins: CLK IN,
RESET
,
IRQ2
,
BR
, MMAP, DR1, DR0.
2
Output pins:
BG
,
PMS
,
DMS
,
BMS
,
RD
,
WR
, A0–A13, CLK OUT , DT 1, DT 0.
3
Bidirectional pins: D0–D23, SCLK 1, RFS1, T FS1, SCLK 0, RFS0, T FS0.
4
T hree-state pins: A0–A13, D0–D23,
PMS
,
DMS
,
BMS
,
RD
,
WR
, DT 1, SCLK 1, RSF1, T FS1, DT 0, SCLK 0, RFS0, T FS0.
5
Input-only pins:
RESET
,
IRQ2
,
BR
, MMAP, DR1, DR0.
6
0 V on
BR
, CLK IN Active (to force three-state condition).
7
Although specified for T T L outputs, all ADSP-2104/ADSP-2109 outputs are CMOS-compatible and will drive to V
DD
and GND, assuming no dc loads.
8
Guaranteed but not tested.
9
Applies to PGA, PLCC, PQFP package types.
10
Output pin capacitance is the capacitive load for any three-stated output pin.
Specifications subject to change without notice.
ADSP-2104/ADSP-2109–SPECIFICATIONS
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADSP-2104/ADSP-2109 processor features proprietary ESD protection circuitry to dissipate
high energy electrostatic discharges (Human Body Model), permanent damage may occur to devices
subjected to such discharges. T herefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality. Unused devices must be stored in conductive foam
or shunts, and the foam should be discharged to the destination socket before the devices are
removed. Per method 3015 of MIL -ST D-883, the ADSP-2104/ADSP-2109 processor has been
classified as Class 1 device.
ABSOLUT E MAX IMUM RAT INGS
*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Output Voltage Swing . . . . . . . . . . . . . . –0.3 V to V
+ 0.3 V
Operating T emperature Range (Ambient) . . . –55oC to +125
°
C
Storage T emperature Range . . . . . . . . . . . . .–65
°
C to +125
°
C
Lead T emperature (10 sec) PGA . . . . . . . . . . . . . . . . . +300
°
C
Lead T emperature (5 sec) PLCC, PQFP, T QFP . . . . +280
°
C
*Stresses greater than those listed above may cause permanent damage to the
device. T hese are stress ratings only, and functional operation of the device at these
or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
WARNING!
ESD SENSITIVE DEVICE
–12–
REV. 0