參數(shù)資料
型號: ADSP-21062
廠商: Analog Devices, Inc.
英文描述: ADSP-2106x SHARC DSP Microcomputer Family
中文描述: 的ADSP - 2106x SHARC處理器DSP的微機家庭
文件頁數(shù): 43/48頁
文件大?。?/td> 370K
代理商: ADSP-21062
ADSP-21062/ADSP-21062L
–43–
REV. C
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21062 is available in 240-lead thermally enhanced
MQFP and 225-lead plastic ball grid array packages. The top
surface of the thermally enhanced MQFP contains a copper slug
from which most of the die heat is dissipated. The slug is flush
with the top surface of the package. Note that the copper slug is
internally connected to GND through the device substrate.
Both packages are specified for a case temperature (T
CASE
). To
ensure that the T
CASE
is not exceeded, a heatsink and/or an air
flow source may be used. A heatsink should be attached with a
thermal adhesive.
T
CASE
=
T
AMB
+
(
PD
×
θ
CA
)
T
CASE
= Case temperature (measured on top surface of package)
PD
=
Power dissipation in W (this value depends upon the
specific application; a method for calculating
PD
is
shown under Power Dissipation).
θ
CA
=
Value from table below.
240 MQFP
JC
= 0.3 C/W
Airflow
(Linear Ft./Min.)
θ
CA
(
°
C/W)
0
100
200
400
600
10
9
8
7
6
NOTES
This represents thermal resistance at total power of 5 W.
With air flow, no variance is seen in
θ
CA
with power.
θ
CA
at 0 LFM varies with power: at 2W,
θ
CA
= 14
°
C/W, at 3W
θ
CA
= 11
°
C/W.
225 PBGA
JC
= 1.7 C/W
Airflow
(Linear Ft./Min.)
θ
CA
(
°
C/W)
0
200
400
20.7
15.3
12.9
NOTE
No variance is seen in
θ
CA
with power.
LOAD CAPACITANCE
pF
0
0
20
40
60
80
100
120
Y = 0.0391X + 0.36
Y = 0.0305X + 0.24
RISE TIME
FALL TIME
140
160
180
200
R
1
2
3
4
5
6
7
8
9
Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs.
Load Capacitance (V
DD
= 3.3 V)
LOAD CAPACITANCE
pF
O
5
1
25
200
50
75
100
125
150
175
4
3
2
1
NOMINAL
Y = 0.0329X
1.65
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (V
DD
= 3.3 V)
相關(guān)PDF資料
PDF描述
ADSP-21062L Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
ADSP-21062LKB-160 ADSP-2106x SHARC DSP Microcomputer Family
ADSP-21065LCCA-240 DSP Microcomputer
ADSP-21065LKS-240 DSP Microcomputer
ADSP-21065LKS-264 DSP Microcomputer
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21062CS-160 功能描述:IC DSP CONTROLLER 32BIT 240MQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21062CSZ-160 功能描述:IC DSP CONTROLLER 32BIT 240MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21062KB-160 功能描述:IC DSP CONTROLLER 32BIT 225BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21062KBZ-160 功能描述:IC DSP CONTROLLER 32BIT 225BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21062KS-133 功能描述:IC DSP CONTROLLER 32BIT 240MQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤