ORDERING INFORMATION(1) PRODUCT PACKAGE" />
參數(shù)資料
型號(hào): ADS1222IPWTG4
廠商: Texas Instruments
文件頁(yè)數(shù): 12/26頁(yè)
文件大?。?/td> 0K
描述: IC 24BIT ADC W/2CH MUX 14-TSSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Basics
視頻文件: Nuts and Bolts of the Delta-Sigma Converter
標(biāo)準(zhǔn)包裝: 250
位數(shù): 24
采樣率(每秒): 240
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 2.25mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 4 個(gè)單端,單極;2 個(gè)差分,雙極
ADS1222
SBAS314B APRIL 2004 REVISED JANUARY 2009
www.ti.com
2
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING NUMBER
TRANSPORT MEDIA,
QUANTITY
ADS1222
TSSOP-14
PW
ADS1222
ADS1222IPWT
Tape and Reel, 250
ADS1222
TSSOP-14
PW
ADS1222
ADS1222IPWR
Tape and Reel, 2000
(1) For the most current specification and package information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
ADS1222
UNIT
VDD to GND
0.3 to +6
V
Input current
100, momentary
mA
Input current
10, continuous
mA
Analog input voltage to GND
0.3 to VDD + 0.3
V
Digital input voltage to GND
0.3 to VDD + 0.3
V
Maximum Junction Temperature
+150
°C
Operating Temperature Range
55 to +125
°C
Storage Temperature Range
60 to +150
°C
Lead Temperature (soldering, 10s)
+300
°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
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