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參數(shù)資料
| 型號： | ADP3522ACP-1.8 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 電源管理 |
| 英文描述： | GSM Power Management System |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, QCC32 |
| 封裝： | 5 X 5 MM, EXPOSED PAD, MO-220-VHHD-2, LFCSP-32 |
| 文件頁數(shù)： | 20/20頁 |
| 文件大?。?/td> | 467K |
| 代理商： | ADP3522ACP-1.8 |
REV. 0
C
2
/
P
–20–
ADP3522
OUTLINE DIMENSIONS
32-Lead Frame Chip Scale Package [LFCSP]
5 mm 5 mm Body
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
12
MAX
0.20 REF
0.05 MAX
0.02 NOM
COPLANARITY
0.08
1.00 MAX
0.65 NOM
1.00
0.90
0.80
1
32
8
9
25
24
16
17
BOTTOM
VIEW
0.50
0.40
0.30
3.50
REF
0.50
BSC
PIN 1
INDICATOR
TOP
5.00
BSC SQ
4.75
BSC SQ
SQ
3.25
3.10
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
SEATING
PLANE
5.36
3.96
3.56
3.80
0.08
0.50
0.20
0.70
0.30
Dimensions shown in millimeters
Figure 11.
5 mm 5 mm LFCSP Pad Pattern
0.60
1.18
1.18
0.60
ARRAY OF 9 VIAS
0.25mm DIAMETER
0.35 m PLATING
THERMAL PAD AREA
Dimensions shown in millimeters
Figure 12. 5 mm 5 mm LFSCP Via Pattern
CREATE SOLDER PASTE
WEB FOR APPROX 80%
COVERAGE 125 MICRONS
WIDE TO SEPARATE
SOLDER PASTE AREA
THERMAL PAD AREA
Figure 13. 5 mm 5 mm LFSCP Solder Paste Mask Pattern
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADP3522ACP-3 | 制造商:AD 制造商全稱:Analog Devices 功能描述:GSM Power Management System |
| ADP3522ACP-3-REEL | 制造商:Analog Devices 功能描述:GSM Power Management System 32-Pin LFCSP EP T/R |
| ADP3522ACP-3-REEL7 | 制造商:Analog Devices 功能描述:GSM Power Management System 32-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述: |
| ADP35622901 | 制造商:LG Corporation 功能描述:Fan Assembly,Propeller |
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