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參數(shù)資料
| 型號(hào)： | ADP125ARHZ-R7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 可調(diào)正電壓單路輸出LDO穩(wěn)壓器 |
| 英文描述： | 5.5V INPUT, 500 MA, LOW QUIESCENT CURRENT, CMOS LINEAR REGULATOR W/EXTERNAL VOLTAGE DIVIDER No of Pins: 8 Temperature Range: Ind |
| 中文描述： | 0.8 V-5 V ADJUSTABLE POSITIVE LDO REGULATOR, 0.23 V DROPOUT, PDSO8 |
| 封裝： | ROHS COMPLIANT, MO-187AAT, MSOP-8 |
| 文件頁數(shù)： | 7/20頁 |
| 文件大?。?/td> | 648K |
| 代理商： | ADP125ARHZ-R7 |
ADP124/ADP125
Rev. A | Page 15 of 20
JUNCTION TEMPERATURE CALCULATIONS
08476-
034
25
35
45
55
65
75
85
95
105
115
125
135
145
0
0.
2
0.
4
0.
6
0.
8
1.
0
1.
2
1.
4
1.
6
1.
8
2.
0
2.
2
2.
4
2.
6
2.
8
3.
0
3.
2
3.
4
3.
6
3.
8
4.
0
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 36. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 25°C
08476-
035
25
35
45
55
65
75
85
95
105
115
125
135
145
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 37. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 25°C
50
60
70
80
90
100
110
120
130
140
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
08476-
036
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 38. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 50°C
50
60
70
80
90
100
110
120
130
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
08476-
037
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 39. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 50°C
08476-
038
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 40. Junction Temperature vs. Power Dissipation, MSOP package
at various Board Temperatures
08476-
039
JUNCT
IO
N
T
E
M
P
E
R
A
T
URE
(
°C)
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 41. Junction Temperature vs. Power Dissipation, LFCSP package
at various Board Temperatures
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