
ADN4668
Rev. A | Page 6 of 12
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VCC to GND
0.3 V to +4 V
Input Voltage (RINx+, RINx) to GND
0.3 V to VCC + 0.3 V
Enable Input Voltage (EN, EN) to GND
0.3 V to VCC + 0.3 V
Output Voltage (ROUTx) to GND
0.3 V to VCC + 0.3 V
Operating Temperature Range
Industrial
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ MAX)
150°C
Power Dissipation
(TJ MAX TA)/θJA
Thermal Impedance, θJA
TSSOP Package
150.4°C/W
SOIC Package
125°C/W ± 5°C
Reflow Soldering Peak Temperature
Pb-Free
260°C ± 5°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION