參數(shù)資料
型號(hào): ADMP401ACEZ-RL
廠商: Analog Devices Inc
文件頁(yè)數(shù): 12/12頁(yè)
文件大?。?/td> 0K
描述: MIC MEMS OMNI-DIR ANALOG 6-LGA
產(chǎn)品變化通告: ADMP401 Mount Change 16/Dec/2011
標(biāo)準(zhǔn)包裝: 4,500
系列: ADMP401-1
類型: MEMS(硅)
輸出類型: 模擬
方向: 全向
頻率范圍: 100Hz ~ 15kHz
靈敏度: -42dB ±3dB
信噪比: 62dB
阻抗: 200 歐姆
電壓 - 額定: 1.5 ~ 3.3V
電流 - 電源: 250µA
端口位置: 底部
密封等級(jí): 無(wú)
端子: 表面貼裝型
尺寸/尺寸: 4.72mm L x 3.76mm W
高度(最大): 1.10mm
形狀: 矩形
包裝: 帶卷 (TR)
其它名稱: ADMP401-1ACEZ-RL
ADMP401-1ACEZ-RL-ND
ADMP401-ACEZ-RL
ADMP401-ACEZ-RL-ND
Data Sheet
ADMP401
Rev. E | Page 9 of 12
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high
shock events above 10 kg are experienced because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste that is used to attach the MEMS microphone to the PCB.
It is recommended that the solder reflow profile not exceed the
limit conditions specified in Figure 2 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
OBSOLETE
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相關(guān)代理商/技術(shù)參數(shù)
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