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參數(shù)資料
| 型號： | ADG719SRJZ-EP-R2 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SW/MUX 2:1 SPDT CMOS |
| 標(biāo)準(zhǔn)包裝： | 250 |
| 功能： | 開關(guān) |
| 電路： | 1 x SPDT |
| 導(dǎo)通狀態(tài)電阻： | 4 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電流 - 電源： | 1nA |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | SOT-23-6 |
| 供應(yīng)商設(shè)備封裝： | SOT-23-6 |
| 包裝： | 帶卷 (TR) |
ADG719
Rev. D | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
0.3 V to +7 V
Analog, Digital Inputs1
0.3 V to VDD + 0.3 V or
30 mA, whichever occurs
first
Peak Current, S or D
100 mA
(Pulsed at 1 ms, 10% duty
cycle max)
Continuous Current, S or D
30 mA
Operating Temperature Range
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
MSOP Package, Power Dissipation
315 mW
θJA Thermal Impedance
206°C/W
θJC Thermal Impedance
44°C/W
SOT-23 Package, Power Dissipation
282 mW
θJA Thermal Impedance
229.6°C/W
θJC Thermal Impedance
91.99°C/W
Lead Soldering
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
220°C
Soldering (Pb-Free)
Reflow, Peak Temperature
260(+0/5)°C
Time at Peak Temperature
20 sec to 40 sec
ESD
1 kV
1 Overvoltages at IN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one maximum rating may be applied at any one time.
ESD CAUTION
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