參數(shù)資料
型號(hào)： ADG708CRUZ-REEL7
廠商： Analog Devices Inc
文件頁數(shù)： 13/20頁
文件大?。?/td> 0K
描述： IC MULTIPLEXER 8X1 16TSSOP
產(chǎn)品培訓(xùn)模塊： Switch Fundamentals
標(biāo)準(zhǔn)包裝： 1,000
功能： 多路復(fù)用器
電路： 1 x 8:1
導(dǎo)通狀態(tài)電阻： 4.5 歐姆
電壓電源： 單/雙電源
電壓 - 電源，單路/雙路(±)： 1.8 V ~ 5.5 V，±2.5 V
電流 - 電源： 1nA
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 帶卷 (TR)
ADG708/ADG709
Data Sheet
Rev. D | Page 20 of 20
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Package Option
ADG708BRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADW54008-0REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
2000–2013 Analog Devices, Inc. All rights reserved. Trademarksand
registered trademarks are the property of their respective owners.
D00041-0-1/13(D)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADG709 制造商:AD 制造商全稱:Analog Devices 功能描述:CMOS, 3 ohm Low Voltage 4-/8-Channel Multiplexers
ADG709BRU 功能描述:IC MULTIPLEXER DUAL 4X1 16TSSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ADG709BRU 制造商:Analog Devices 功能描述:SEMICONDUCTORS ((NW))
ADG709BRU-REEL 功能描述:IC MULTIPLEXER DUAL 4X1 16TSSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ADG709BRU-REEL7 功能描述:IC MULTIPLEXER DUAL 4X1 16TSSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
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