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REV. 0
ADG619/ADG620
–4–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog Inputs
2
. . . . . . . . . . . . . . . . V
SS
–0.3 V to V
DD
+0.3 V
Digital Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 50 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
Micro-SOIC Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206
°
C/W
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44
°
C/W
SOT-23 Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6
°
C/W
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99
°
C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300
°
C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
ORDERING GUIDE
Branding
Information
*
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADG619BRM
ADG619BRT
ADG620BRM
ADG620BRT
SVB
SVB
SWB
SWB
Micro-SOIC (microSmall Outline IC)
SOT-23 (Plastic Surface Mount)
Micro-SOIC (microSmall Outline IC)
SOT-23 (Plastic Surface Mount)
RM-8
RT-8
RM-8
RT-8
*
Branding on SOT-23 and Micro-SOIC packages is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG619/ADG620 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN CONFIGURATIONS
8-Lead SOT-23
(RT-8)
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
NC = NO CONNECT
D
S1
NC
V
DD
S2
GND
IN
V
SS
ADG619/
ADG620
8-Lead Micro-SOIC
(RM-8)
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
NC = NO CONNECT
D
S1
NC
V
DD
S2
GND
IN
V
SS
ADG619/
ADG620