參數(shù)資料
型號(hào): ADG604
廠商: Analog Devices, Inc.
英文描述: 1 pC Charge Injection, 100 pA Leakage CMOS 5 V/5 V/3 V 4-Channel Multiplexer
中文描述: 1件電荷注入,100功率放大器泄漏CMOS 5伏/ 5伏/ 3伏4通道多路復(fù)用器
文件頁數(shù): 5/12頁
文件大?。?/td> 155K
代理商: ADG604
REV. 0
ADG604
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG604 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog Inputs
2
. . . . . . . . . . . . . . . . V
SS
–0.3 V to V
DD
+ 0.3 V
Digital Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 10 mA
Operating Temperature Range
Automotive (Y Version) . . . . . . . . . . . . . . –40
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
ORDERING GUIDE
Model Option
Temperature Range
–40
°
C to +125
°
C
Package Description
Package
ADG604YRU
Thin Shrink Small Outline (TSSOP)
RU-14
PIN CONFIGURATION
A0
EN
V
SS
S1
S2
D
NC
1
A1
GND
V
DD
S3
S4
NC
NC
ADG604
2
3
4
5
6
7
14
13
12
11
10
9
8
TOP VIEW
(Not To Scale)
NC = NO CONNECT
Table I. Truth Table
A1
A0
EN
ON Switch
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
None
1
2
3
4
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
TSSOP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 150
°
C/W
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 27
°
C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300
°
C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at EN, A0, A1, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
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