參數(shù)資料
型號(hào): ADG5204BRUZ-RL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 11/20頁(yè)
文件大?。?/td> 0K
描述: MUX 4CH LATCH-UP PROOF 14TSSOP
標(biāo)準(zhǔn)包裝: 1,000
功能: 多路復(fù)用器
電路: 1 x 4:1
導(dǎo)通狀態(tài)電阻: 170 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 9 V ~ 40 V,±9 V ~ ±22 V
電流 - 電源: 85µA
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
ADG5204
Rev. 0 | Page 19 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
06
19
08
-A
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 34. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
2.70
2.60 SQ
2.50
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGC.
1
0.65
BSC
BOTTOM VIEW
TOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.45
0.40
0.35
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
08-
16-2010-C
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
ADG5204BRUZ
40°C to +125°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG5204BRUZ-RL7
40°C to +125°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG5204BCPZ-RL7
40°C to +125°C
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-16-17
1 Z = RoHS Compliant Part.
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