TA = 25°C unless ot" />
參數(shù)資料
型號: ADG444BR
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大?。?/td> 0K
描述: IC SWITCH QUAD SPST 16SOIC
產(chǎn)品培訓(xùn)模塊: Switch Fundamentals
標(biāo)準(zhǔn)包裝: 48
系列: LC²MOS
功能: 開關(guān)
電路: 4 x SPST - NC
導(dǎo)通狀態(tài)電阻: 110 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 12V,±15V
電流 - 電源: 1nA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 管件
ADG441/ADG442/ADG444
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to VDD + 0.3 V
Analog, Digital Inputs
VSS 2 V to VDD + 2 V or 30 mA, Whichever Occurs First
Continuous Current, S or D
30 mA
Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Max)
100 mA
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Lead Temperature, Soldering (10 sec)
300°C
Plastic Package, Power Dissipation
470 mW
θJA, Thermal Impedance
177°C/W
Lead Temperature, Soldering (10 sec)
260°C
SOIC Package, Power Dissipation
600 mW
θJA, Thermal Impedance
77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum
rating may be applied at any one time.
Table 4. Truth Table
ADG441/ADG444 IN
ADG442 IN
Switch Condition
0
1
ON
1
0
OFF
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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