
ADG441/ADG442/ADG444
REV. 0
–4–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
V
L
to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog, Digital Inputs
2
. . . . . . . . . . . . V
SS
– 2 V to V
DD
+ 2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . .–40
°
C to +85
°
C
Extended (T Version) . . . . . . . . . . . . . . . .–55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . .–65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . .900 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 76
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . +300
°
C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . .470 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 177
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . +260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . .600 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 77
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. Only
one absolute maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
ADG441/ADG442 PIN CONFIGURATION (DIP/SOIC)
NC = NO CONNECT
IN1
D1
IN2
D2
GND
S4
D4
NC
S3
D3
S1
V
SS
S2
V
DD
IN4
IN3
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG441
ADG442
ADG444 PIN CONFIGURATION (DIP/SOIC)
TERMINOLOGY
V
DD
V
SS
Most Positive Power Supply Potential.
Most Negative Power Supply Potential in dual
supplies. In single supply applications, it may be
connected to ground.
Logic Power Supply (+5 V).
Ground (0 V) Reference.
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input.
Ohmic resistance between D and S.
Difference between the R
ON
of any two channels.
Source leakage current with the switch “OFF.”
Drain leakage current with the switch “OFF.”
Channel leakage current with the switch “ON.”
Analog voltage on terminals D, S.
“OFF” Switch Source Capacitance.
“OFF” Switch Drain Capacitance.
“ON” Switch Capacitance.
Delay between applying the digital control
input and the output switching on.
Delay between applying the digital control
input and the output switching off.
Break-Before-Make Delay when switches are
configured as a multiplexer.
A measure of unwanted signal which is coupled
through from one channel to another as a result
of parasitic capacitance.
A measure of unwanted signal coupling through
an “OFF” switch.
A measure of the glitch impulse transferred from
the digital input to the analog output during
switching.
V
L
GND
S
D
IN
R
ON
R
ON
Match
I
S
(OFF)
I
D
(OFF)
I
D
, I
S
(ON)
V
D
(V
S
)
C
S
(OFF)
C
D
(OFF)
C
D
, C
S
(ON)
t
ON
t
OFF
t
OPEN
Crosstalk
Off Isolation
Charge
Injection
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
IN1
D1
IN2
D2
GND
S4
D4
V
L
S3
D3
S1
V
SS
S2
V
DD
IN4
IN3
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG444