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| 型號(hào)： | ADG417BR-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 4/8頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH SPST 8SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Switch Fundamentals |
| 產(chǎn)品變化通告： | Product Discontinuance 27/Oct/2011 |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | LC²MOS |
| 功能： | 開(kāi)關(guān) |
| 電路： | 1 x SPST- NC |
| 導(dǎo)通狀態(tài)電阻： | 40 歐姆 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 12V，±15V |
| 電流 - 電源： | 100pA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
REV. A
–4–
ADG417
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted)
VDD to VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Analog, Digital Inputs
2
. . . . . . . . . . . . . VSS – 2 V to VDD +2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 100
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 155
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
VD (VS)
Analog voltage on terminals D, S.
CS (OFF)
“OFF” switch source capacitance.
CD (OFF)
“OFF” switch drain capacitance.
CD, CS (ON)
“ON” switch capacitance.
tON
Delay between applying the digital control
input and the output switching on.
tOFF
Delay between applying the digital control
input and the output switching off.
VINL
Maximum input voltage for logic “0.”
VINH
Minimum input voltage for logic “1.”
IINL (IINH)
Input current of the digital input.
Charge Injection
A measure of the glitch impulse transferred
from the digital input to the analog output
during switching.
Off Isolation
A measure of unwanted signal coupling
through an “OFF” channel.
IDD
Positive supply current.
ISS
Negative supply current.
IL
Logic supply current.
TERMINOLOGY
VDD
Most positive power supply potential.
VSS
Most negative power supply potential in dual
supplies. In single supply applications, it
may be connected to GND.
VL
Logic power supply (+5 V).
GND
Ground (0 V) reference.
S
Source terminal. May be an input or an
output.
D
Drain terminal. May be an input or an
output.
IN
Logic control input.
RON
Ohmic resistance between D and S.
IS (OFF)
Source leakage current with the switch
“OFF.”
ID (OFF)
Drain leakage current with the switch
“OFF.”
ID, IS (ON)
Channel leakage current with the switch
“ON.”
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG417 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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| ADG417BRZ | 功能描述:IC SWITCH SPST 8SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開(kāi)關(guān)，多路復(fù)用器，多路分解器 系列:LC²MOS 特色產(chǎn)品:MicroPak? 標(biāo)準(zhǔn)包裝:1 系列:- 功能:開(kāi)關(guān) 電路:2 x SPST - NC 導(dǎo)通狀態(tài)電阻:500 毫歐 電壓電源:單電源 電壓 - 電源，單路/雙路(±):1.4 V ~ 4.3 V 電流 - 電源:150nA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-XFDFN 供應(yīng)商設(shè)備封裝:8-XSON，SOT833-1 （1.95x1） 包裝:Digi-Reel® 其它名稱:568-5557-6 |
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