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參數(shù)資料
| 型號： | ADG3246 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 2.5 V/3.3 V, 10-Bit, 2-Port Level Translating, Bus Switch |
| 中文描述： | 2.5 V/3.3五，10位，2端口級翻譯，總線開關 |
| 文件頁數(shù)： | 3/12頁 |
| 文件大小： | 353K |
| 代理商： | ADG3246 |
PRELIMINARY TECHNICAL DATA
REV. Pr
C
ADG3246
–3–
ABSOLUTE MAXIMUM RATINGS
*
(T
A
= 25
°
C, unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
LFCSP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 35
°
C/W
TSSOP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 128
°
C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°
C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maximum
rating may be applied at any one time.
Table I. Pin Description
Pin Mnemonic
Description
BE
SEL
Ax
Bx
Bus Enable (Active Low)
Level Translation Select
Port A, Inputs or Outputs
Port B, Inputs or Outputs
PIN CONFIGURATION
24-Lead LFCSP and 24-Lead TSSOP
PIN 1
TOP VIEW
18
BE
17 B0
16 B1
15 B2
14 B3
13 B4
SEL
1
A5 2
A6 3
A7 4
A8 5
A9 6
2
G
B
B
B
B
B
2
2
2
2
1
C
ADG3246
GND
A6
A0
A1
A2
A5
A4
A3
B7
B6
B5
BE
B0
B1
B4
B3
B2
SEL
V
CC
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADG3246
A9
A8
A7
B8
B9
Table II. Truth Table
BE
SEL
*
Function
L
L
H
L
H
X
A = B, 3.3 V to 1.8 V Level Shifting
A = B, 3.3 V to 2.5 V/2.5V to 1.8 V Level Shifting
Disconnect
*
SEL
= 0 only when V
DD
= 3.3 V
±
10%
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADG3246BCP
ADG3246BRU
Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
CP-24
RU-24
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3246 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
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相關代理商/技術參數(shù) |
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|---|---|
| ADG3246BCP | 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述: |
| ADG3246BCP-REEL7 | 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述: |
| ADG3246BCPZ | 功能描述:IC SW BUS 10BIT 2.5/3.3V 24LFCSP RoHS:是 類別:集成電路 (IC) >> 邏輯 - 信號開關，多路復用器，解碼器 系列:- 標準包裝:1 系列:74LVC 類型:解碼器/多路分解器 電路:1 x 2:4 獨立電路:2 輸出電流高，低:24mA，24mA 電壓電源:單電源 電源電壓:1.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.209"，5.30mm 寬） 供應商設備封裝:16-SO 包裝:Digi-Reel® 其它名稱:296-28947-6 |
| ADG3246BCPZ-REEL7 | 功能描述:IC SW BUS 10BIT 2.5/3.3V 24LFCSP RoHS:是 類別:集成電路 (IC) >> 邏輯 - 信號開關，多路復用器，解碼器 系列:- 標準包裝:48 系列:74VHC 類型:多路復用器 電路:4 x 2:1 獨立電路:1 輸出電流高，低:8mA，8mA 電壓電源:單電源 電源電壓:2 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:管件 |
| ADG3246BRU | 制造商:Analog Devices 功能描述:BUS SWIT 1-ELEM 10-IN 24TSSOP - Rail/Tube |
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