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參數(shù)資料
| 型號(hào)： | ADG3245BCPZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | IC SW BUS 2.5-3.3V 8BIT 20LFCSP |
| 標(biāo)準(zhǔn)包裝： | 490 |
| 類型： | 總線開關(guān) |
| 電路： | 8 x 1:1 |
| 獨(dú)立電路： | 1 |
| 電壓電源： | 單電源 |
| 電源電壓： | 2.5V, 3.3V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 20-LFCSP-VQ |
| 包裝： | 托盤 |
REV.
ADG3245
–3–
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
LFCSP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 30.4
°C/W
TSSOP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 143
°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
Table II. Truth Table
BE SEL*
Function
L
A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
H
X
Disconnect
*
SEL = 0 V only when V
DD = 3.3 V
± 10%
PIN CONFIGURATION
20-Lead LFCSP and TSSOP
TOP VIEW
(Not to Scale)
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
ADG3245
GND
A7
A6
A0
A1
A2
A5
A4
A3
B7
B6
B5
BE
B0
B1
B4
B3
B2
SEL
VCC
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. A
–11–
EP
Exposed Pad. It is
recommended that
the exposed pad be
thermally connected
to a copper plane for
enhanced thermal
performance. The pad
should be grounded as
well.
Table I. Pin Description
Mnemonic Description
BE
Bus Enable (Active Low)
SEL
Level Translation Select
Ax
Port A, Inputs or Outputs
Bx
Port B, Inputs or Outputs
EP
Exposed Pad. It is recommended
that the exposed pad be thermally
connected to a copper plane for
enhanced thermal performance.
The pad should be grounded as
well.
B
NOTES
1. IT IS RECOMMENDED THAT THE EXPOSED PAD BE
THERMALLY CONNECTED TO A COPPER PLANE
FOR ENHANCED THERMAL PERFORMANCE. THE
PAD SHOULD BE GROUNDED AS WELL.
14
13
12
1
3
4
B0
15 BE
B1
B2
11 B3
SEL
A5
2
A4
A6
5
A7
7
B
7
6
G
N
D
8
B
6
9
B
5
1
0
B
4
1
9
A
2
0
A
3
1
8
A
1
7
A
0
1
6
V
C
ADG3245
TOP VIEW
(Not to Scale)
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