參數(shù)資料
型號(hào)： ADF4106
廠商： Analog Devices, Inc.
元件分類： XO, clock
英文描述： PLL Frequency Synthesizer
中文描述： 鎖相環(huán)頻率合成器
文件頁(yè)數(shù)： 4/20頁(yè)
文件大?。?/td> 228K
代理商： ADF4106
REV. 0
ADF4106
–4–
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25
°
C unless otherwise noted.)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +3.6 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +5.3 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . .
–
0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . .
–
0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . .
–
0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . .
–
40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . .
–
65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°
C
TSSOP
JA
Thermal Impedance . . . . . . . . . . . . . 150.4
°
C/W
CSP
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . 122
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
<2 kV and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3
GND = AGND = DGND = 0 V
ORDERING GUIDE
Model
Temperature Range
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
Package Option
*
ADF4106BRU
ADF4106BCP
RU-16
CP-20
*
RU = Thin Shrink Small Outline Package (TSSOP)
CP = Chip Scale Package
Contact the factory for chip availability.
Note that aluminum bond wire should not be used with the ADF4106 die.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF4106 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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