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參數(shù)資料
| 型號(hào)： | ADCLK946/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 8/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | KIT EVAL CLK BUFF ADCLK946 |
| 設(shè)計(jì)資源： | ADCLK946 Schematic ADCLK946 Gerber File ADCLK946 BOM |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，時(shí)鐘緩沖器 / 驅(qū)動(dòng)器 / 接收器 / 變換器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADCLK946 |
| 主要屬性： | 1 輸入，6 輸出 |
| 次要屬性： | LVPECL 輸出邏輯 |
| 已供物品： | 板 |
ADCLK946
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
VCC VEE
6.0 V
Input Voltage
CLK, CLK
VEE 0.5 V to
VCC + 0.5 V
CLK, CLK to VT Pin (CML, LVPECL
Termination)
±40 mA
CLK to CLK
±1.8 V
Input Termination, VT to CLK, CLK
±2 V
Maximum Voltage on Output Pins
VCC + 0.5 V
Maximum Output Current
35 mA
Voltage Reference (VREF)
VCC to VEE
Operating Temperature Range
Ambient
40°C to +85°C
Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
PD is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order approx-
imation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 5.
Parameter
Symbol
Description
Value1
Unit
Junction-to-Ambient Thermal Resistance
Still Air
0.0 m/sec Airflow
θJA
Per JEDEC JESD51-2
54.3
°C/W
Moving Air
1.0 m/sec Airflow
θJMA
Per JEDEC JESD51-6
47.5
°C/W
2.5 m/sec Airflow
θJMA
Per JEDEC JESD51-6
42.6
°C/W
Junction-to-Board Thermal Resistance
Moving Air
1.0 m/sec Airflow
θJB
Per JEDEC JESD51-8 (moving air)
33.0
°C/W
Junction-to-Case Thermal Resistance (Die-to-Heat Sink)
Moving Air
θJC
Per MIL-Std. 883, Method 1012.1
2.0
°C/W
Junction-to-Top-of-Package Characterization Parameter
Still Air
0 m/sec Airflow
ΨJT
Per JEDEC JESD51-2
0.9
°C/W
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADCLK948 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Two Selectable Inputs, 8 LVPECL Outputs, SiGe Clock Fanout Buffer |
| ADCLK948/PCBZ | 功能描述:BOARD EVALUATION FOR ADCLK948 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:SIGe 標(biāo)準(zhǔn)包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
| ADCLK948BCPZ | 功能描述:IC CLOCK BUFFER MUX 2:8 32-LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:SIGe 產(chǎn)品培訓(xùn)模塊:High Bandwidth Product Overview 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ADCLK948BCPZ | 制造商:Analog Devices 功能描述:CLOCK FANOUT BUFFER, 4.8GHZ, LFCSP-32 |
| ADCLK948BCPZ-REEL7 | 功能描述:IC CLOCK BUFFER MUX 2:8 32-LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:SIGe 標(biāo)準(zhǔn)包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:32-QFN（5x5） 包裝:管件 |
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