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參數(shù)資料
| 型號(hào)： | ADCLK914/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 8/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADCLK914 |
| 設(shè)計(jì)資源： | ADCLK9xx Eval Brd Schematics ADCLK914 Gerber File ADCLK914 BOM |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，時(shí)鐘分配 |
| 已用 IC / 零件： | ADCLK914 |
| 已供物品： | 板 |
ADCLK914
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (VCC to GND)
6.0 V
Input Voltage
0.5 V to VCC + 0.5 V
Maximum Output Voltage
VCC + 0.5 V
Minimum Output Voltage
VEE 0.5 V
Input Termination
±2 V
Voltage Reference
VCC VEE
Operating Temperature Range, Ambient
40°C to +125°C
Operating Temperature, Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
The ADCLK914 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, use an airflow source.
To determine the junction temperature on the application PCB
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
top center of package.
Ψ
JT
is determined by the values listed in Table 3.
PD is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided for package comparison and PCB
design considerations.
Table 3. Thermal Parameters for ADCLK914 16-Lead LFCSP
Symbol
Value
Units
θ
JA
Junction-to-ambient thermal
resistance, 0.0 meters per sec air
flow per JEDEC JESD51-2 (still air)
78.4
°C/W
θ
JMA
Junction-to-ambient thermal
resistance, 1.0 meter per sec air flow
per JEDEC JESD51-6 (moving air)
68.5
°C/W
θ
JMA
Junction-to-ambient thermal
resistance, 2.5 m/s air flow per
JEDEC JESD51-6 (moving air)
61.4
°C/W
θ
JB
Junction-to-board thermal
resistance, 1.0 meter per sec air flow
per JEDEC JESD51-8 (moving air)
48.8
°C/W
θ
JC
Junction-to-case thermal resistance
(die-to-heatsink) per MIL-Std 883,
Method 1012.1
1.5
°C/W
Ψ
JT
Junction-to-top-of-package
characterization parameter, 0
meters per sec air flow per JEDEC
JESD51-2 (still air)
2.0
°C/W
1 Descriptions based on using a 2s2p test board.
ESD CAUTION
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