參數(shù)資料
型號(hào)： ADC0808S125HW
廠商： NXP Semiconductors N.V.
元件分類： 外設(shè)及接口
英文描述： Single 8-bit ADC, up to 125 Msps
封裝： ADC0808S125HW/C1<SOT545-2 (HTQFP48)|<<http://www.nxp.com/packages/SOT545-2.html<1<Always Pb-free,;ADC0808S125HW/C1<SOT545-2 (HTQFP48)|<<http://www.nxp.com/packages/SOT545
文件頁(yè)數(shù)： 19/23頁(yè)
文件大小： 121K
代理商： ADC0808S125HW
ADC0808S125_ADC0808S250_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 24 February 2009
19 of 23
NXP Semiconductors
ADC0808S125/250
Single 8-bit ADC, up to 125 MHz or 250 MHz
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 13
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14
and
15
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 13
.
Table 14.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 15.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
ADC0808S125HW Single 8-bit ADC, up to 125 Msps
ADC0808S250HW Single 8-bit ADC, up to 250 Msps
ADC1002S020HL Single 10 bits ADC, up to 20 MHz
ADC1002S020HL Single 10 bits ADC, up to 20 MHz
ADC1003S030TS Single 10 bits ADC up to 30 Msps, with voltage regulator
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADC0808S125HW/C1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single 8-bit ADC, up to 125 MHz or 250 MHz
ADC0808S125HW/C1,1 功能描述:模數(shù)轉(zhuǎn)換器 - ADC ADC Single 125MSPS 8-Bit Parallel RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADC0808S125HW/C1,5 功能描述:模數(shù)轉(zhuǎn)換器 - ADC IC ADC 8BIT 125MHZ SGL RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADC0808S125HW/C1,518 制造商:NXP Semiconductors 功能描述:Cut Tape 制造商:NXP Semiconductors 功能描述:0
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*