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參數(shù)資料
| 型號： | ADA4938-1YCPZ-R2 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Ultra-Low Distortion Differential ADC Driver |
| 中文描述： | 超低失真差分ADC驅(qū)動器 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 194K |
| 代理商： | ADA4938-1YCPZ-R2 |
Preliminary Technical Data
ADA4938-1
ABSOLUTE MAXIMUM RATINGS
Rev. PrA | Page 7 of 9
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum
Rating may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions; that is, θ
JA
is
specified for a device (including exposed pad) soldered to
the circuit board.
Rating
TBD
See Figure 2
65°C to +125°C
40°C to +85°C
300°C
150°C
Table 4. Thermal Resistance
Package Type
16-Lead LFCSP (Exposed Pad)
θ
JA
TBD
Unit
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4938-1
package is limited by the associated rise in junction
temperature (T
J
) on the die. At approximately 150°C, which
is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature
limit can change the stresses that the package exerts on the
die, permanently shifting the parametric performance of
the ADA4938-1. Exceeding a junction temperature of 150°C
for an extended period can result in changes in the silicon
devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the
voltage between the supply pins (V
S
) times the quiescent
current (I
S
). The power dissipated due to the load drive depends
upon the particular application. The power due to load drive is
calculated by multiplying the load current by the associated
voltage drop across the device. RMS voltages and currents must
be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through-holes, ground,
and power planes reduces the θ
JA
.
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(TBD °C/W) on a JEDEC standard 4-layer board.
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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| ADA4938-1YCPZ-RL | Ultra-Low Distortion Differential ADC Driver |
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4938-1YCPZ-R7 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Ultra-Low Distortion Differential ADC Driver |
| ADA4938-1YCPZ-RL | 制造商:AD 制造商全稱:Analog Devices 功能描述:Ultra-Low Distortion Differential ADC Driver |
| ADA4938-2ACP-EBZ | 功能描述:24-LFCSP Package 2 - Dual Channels per IC Differential Amplifier Evaluation Board 制造商:analog devices inc. 系列:- 零件狀態(tài):過期 每 IC 通道數(shù):2 - 雙 放大器類型:差分 輸出類型:差分 壓擺率:- -3db 帶寬:- 電流 - 輸出/通道:- 工作溫度:- 電流 - 電源（主 IC）:- 電壓 - 電源，單/雙（±）:- 板類型:裸（未填充） 所含物品:板 使用的 IC/零件:24-LFCSP 封裝 標準包裝:1 |
| ADA4938-2ACPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Dual ±5.5V/11V 24-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:SP AMP DIFF AMP DUAL 5.5V/11V 24LFCSP EP - Tape and Reel 制造商:Analog Devices 功能描述:ANAADA4938-2ACPZ-R2 DUAL ULTRA-LOW DISTO 制造商:Analog Devices 功能描述:IC DIFF AMP 1GHZ 4700V/S LFCSP-24 |
| ADA4938-2ACPZ-R7 | 功能描述:IC ADC DRIVER DIFF DUAL 24LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
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