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參數(shù)資料
| 型號(hào)： | ADA4937-1YCPZ-R7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | Ultralow Distortion, Differential ADC Driver |
| 中文描述： | LINE DRIVER, QCC16 |
| 封裝： | 3 X 3 MM, ROHS COMPLIANT, MO-220VEED-2, LFCSP-16 |
| 文件頁數(shù)： | 7/28頁 |
| 文件大小： | 448K |
| 代理商： | ADA4937-1YCPZ-R7 |
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ADA4937-1
ABSOLUTE MAXIMUM RATINGS
Rev. 0 | Page 7 of 28
Table 5.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Rating
5.5 V
See Figure 3
65°C to +125°C
40°C to +105°C
300°C
150°C
Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device (including exposed pad)
soldered to a high thermal conductivity 2s2p circuit board,
as described in EIA/JESD 51-7.
Table 6. Thermal Resistance
Package Type
16-Lead LFCSP (Exposed Pad)
θ
JA
95
Unit
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4937-1
package is limited by the associated rise in junction
temperature (T
J
) on the die. At approximately 150°C,
which is the glass transition temperature, the plastic
changes its properties. Even temporarily exceeding this
temperature limit can change the stresses that the package
exerts on the die, permanently shifting the parametric
performance of the ADA4937-1. Exceeding a junction
temperature of 150°C for an extended period can result in
changes in the silicon devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
S
) times the quiescent current (I
S
).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through holes, ground,
and power planes reduces the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(95°C/W) on a JEDEC standard 4-layer board.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–45
105
95
85
75
65
55
45
35
25
15
5
–5
AMBIENT TEMPERATURE (°C)
–15
–25
–35
M
0
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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| ADA4937-1YCPZ-RL | 功能描述:IC ADC DIFF DRIVER 16-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
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| ADA4937-2YCPZ-R2 | 制造商:Analog Devices 功能描述:SP AMP DIFF AMP DUAL 5.25V 24LFCSP EP - Tape and Reel 制造商:Analog Devices 功能描述:IC DIFF AMP 1.9GHZ 6000V/ LFCSP-24 制造商:Analog Devices 功能描述:IC, DIFF AMP, 1.9GHZ, 6000V/ uS, LFCSP-24, No. of Amplifiers:2, Input Offset Vol |
| ADA4937-2YCPZ-R7 | 功能描述:IC ADC DRIVER DIFF DUAL 24LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
| ADA4937-2YCPZ-RL | 功能描述:IC ADC DRIVER DUAL DIFF 24LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
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