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參數(shù)資料
| 型號： | ADA4932-2YCP-EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 18/29頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4932-2YCP |
| 標準包裝： | 1 |
| 每 IC 通道數(shù)： | 2 - 雙 |
| 放大器類型： | 差分 |
| 板類型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 24-LFCSP 封裝 |
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ADA4932-1/ADA4932-2
Data Sheet
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4932-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as much
of the board area around the ADA4932-x as possible. However,
the area near the feedback resistors (RF), gain resistors (RG), and
the input summing nodes (Pin 2 and Pin 3) should be cleared of
all ground and power planes (see Figure 64). Clearing the ground
and power planes minimizes any stray capacitance at these nodes
and thus minimizes peaking of the response of the amplifier at
high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
07752-
055
Figure 64. Ground and Power Plane Voiding in Vicinity of RF and RG
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. High frequency ceramic
chip capacitors should be used. It is recommended that two
parallel bypass capacitors (1000 pF and 0.1 F) be used for each
supply. Place the 1000 pF capacitor closer to the device. Further
away, provide low frequency bulk bypassing using 10 F tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic effects.
Wherever complementary signals exist, provide a symmetrical
layout to maximize balanced performance. When routing
differential signals over a long distance, keep PCB traces close
together, and twist any differential wiring to minimize loop
area. Doing this reduces radiated energy and makes the circuit
less susceptible to interference.
1.30
0.80
1.30
07752-
056
Figure 65. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07752-
057
Figure 66. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
Rev. C | Page 24 of 28
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4932-2YCPZ-R2 | 功能描述:IC AMP DIFF DUAL LP 80MA 24LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:14-SOIC 包裝:帶卷 (TR) |
| ADA4932-2YCPZ-R2 | 制造商:Analog Devices 功能描述:IC DIFF AMP 560MHZ 2800V/ LFCSP-16 |
| ADA4932-2YCPZ-R21 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power Differential ADC Driver |
| ADA4932-2YCPZ-R7 | 功能描述:IC AMP DIFF DUAL LP 80MA 24LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:150 系列:- 放大器類型:音頻 電路數(shù):2 輸出類型:- 轉換速率:5 V/µs 增益帶寬積:12MHz -3db帶寬:- 電流 - 輸入偏壓:100nA 電壓 - 輸入偏移:500µV 電流 - 電源:6mA 電流 - 輸出 / 通道:50mA 電壓 - 電源，單路/雙路(±):4 V ~ 32 V，±2 V ~ 16 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:8-TSSOP 包裝:管件 |
| ADA4932-2YCPZ-R71 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power Differential ADC Driver |
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