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參數資料
| 型號： | ADA4930-1YCP-EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 17/29頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADA4930-1YCP |
| 標準包裝： | 1 |
| 每 IC 通道數： | 1 - 單 |
| 放大器類型： | 差分 |
| 板類型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 16-LFCSP 封裝 |
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ADA4930-1/ADA4930-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
The ADA4930-1/ADA4930-2 are high speed devices. Realizing
their superior performance requires attention to the details of
high speed PCB design.
The first requirement is to use a multilayer PCB with solid ground
and power planes that cover as much of the board area as possible.
Bypass each power supply pin directly to a nearby ground plane, as
close to the device as possible. Use 0.1 μF high frequency ceramic
chip capacitors.
Provide low frequency bulk bypassing, using 10 μF tantalum
capacitors from each supply to ground.
Stray transmission line capacitance in combination with package
parasitics can potentially form a resonant circuit at high frequencies,
resulting in excessive gain peaking or possible oscillation.
Signal routing should be short and direct to avoid such parasitic
effects. Provide symmetrical layout for complementary signals
to maximize balanced performance.
0
92
09
-0
58
Figure 56. ADA4930-1 Ground and Power Plane Voiding
in the Vicinity of RF and RG
Use radio frequency transmission lines to connect the driver
and receiver to the amplifier.
Minimize stray capacitance at the input/output pins by clearing
the underlying ground and low impedance planes near these pins
If the driver/receiver is more than one-eighth of the wavelength
from the amplifier, the signal trace widths should be minimal.
This nontransmission line configuration requires the underlying
and adjacent ground and low impedance planes to be cleared
near the signal lines.
The exposed thermal paddle is internally connected to the ground
pin of the amplifier. Solder the paddle to the low impedance
ground plane on the PCB to ensure the specified electrical
performance and to provide thermal relief. To reduce thermal
impedance further, it is recommended that the ground planes
on all layers under the paddle be connected together with vias.
1.30
0.80
1.30
09
20
9-
0
59
Figure 57. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)
0.8 mm
1.3 mm
POWER PLANE
GROUND PLANE
TOP METAL
BOTTOM METAL
09
20
9-
06
0
Figure 58. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ADA4930-1YCPZ | 制造商:Analog Devices 功能描述:IC AMP DIFF 1.35GHZ 16-LFCSP 制造商:Analog Devices 功能描述:IC, AMP, DIFF, 1.35GHZ, 16-LFCSP 制造商:Analog Devices 功能描述:IC, AMP, DIFF, 1.35GHZ, 16-LFCSP; No. of Amplifiers:1; Input Offset Voltage:350V; Bandwidth:1.35GHz; Amplifier Case Style:LFCSP; No. of Pins:16; Supply Voltage Range:3.3V, 5V; Slew Rate:3400V/s; Supply Current:34mA; Operating ;RoHS Compliant: Yes |
| ADA4930-1YCPZ-R2 | 功能描述:IC DIFF AMP 1.35GHZ 16-LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1,000 系列:- 放大器類型:電壓反饋 電路數:4 輸出類型:滿擺幅 轉換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:14-SOIC 包裝:帶卷 (TR) |
| ADA4930-1YCPZ-R7 | 功能描述:差分放大器 UltraLow Dist Low Vltg ADC Driver RoHS:否 制造商:Analog Devices 通道數量:1 Channel 帶寬:900 MHz 可用增益調整:5.6 dB to 20 dB 輸入補償電壓:1 mV at 5 V 共模抑制比（最小值）:67 dB 工作電源電壓:11 V 電源電流:28 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Reel |
| ADA4930-1YCPZ-R7_PROMO | 制造商:Analog Devices 功能描述:IC DIFF AMPLIFIER 1.35GHZ L |
| ADA4930-1YCPZ-RL | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single 5.5V 16-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:ULTRALOW DIST LOW VLTG ADC DRIVER - Tape and Reel 制造商:Analog Devices Inc. 功能描述:Differential Amplifiers UltraLow Dist Low Vltg ADC Driver |
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