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| 型號(hào)： | ADA4853-3YCPZ-RL |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power Disable |
| 中文描述： | 1 CHANNEL, VIDEO AMPLIFIER, QCC16 |
| 封裝： | 3 X 3 MM, ROHS COMPLIANT, MO-220VEED-2, LFCSP-16 |
| 文件頁(yè)數(shù)： | 5/16頁(yè) |
| 文件大?。?/td> | 436K |
| 代理商： | ADA4853-3YCPZ-RL |
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ADA4853-1/ADA4853-2/ADA4853-3
ABSOLUTE MAXIMUM RATINGS
Rev. B | Page 5 of 16
Table 3.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
6-Lead SC70
16-Lead LFCSP_VQ
14-Lead TSSOP
Lead Temperature
Junction Temperature
Rating
5.5 V
See Figure 6
V
S
0.2 V to +V
S
1.2 V
±V
S
65°C to +125°C
40°C to +85°C
40°C to +105°C
40°C to +105°C
JEDEC J-STD-20
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is
specified for the device soldered in the circuit board for surface-
mount packages.
Table 4.
Package Type
6-Lead SC70
16-Lead LFCSP_VQ
14-Lead TSSOP
θ
JA
430
63
120
Unit
°C/W
°C/W
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4853-1/
ADA4853-2/ADA4853-3 is limited by the associated rise in
junction temperature (T
J
) on the die. At approximately 150
°
C,
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
can change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
The power dissipated in the package (P
D
) for a sine wave and a
resistor load is the total power consumed from the supply
minus the load power.
P
D
=
Total Power Consumed
Load Power
(
SUPPLY
VOLTAGE
SUPPLY
D
I
V
P
)
L
OUT
R
CURRENT
V
2
–
×
=
RMS output voltages should be considered.
Airflow increases heat dissipation, effectively reducing θ
JA
.
In addition, more metal directly in contact with the package
leads and through holes under the device reduces θ
JA
.
Figure 6 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SC70
(430°C/W), the 14-lead TSSOP (120°C/W), and the 16-lead
LFCSP_VQ (63°C/W) on a JEDEC standard 4-layer board. θ
JA
values are approximations.
3.0
0
125
105
85
65
45
25
5
–15
–35
–55
AMBIENT TEMPERATURE (°C)
M
2.5
2.0
1.5
1.0
0.5
SC70
TSSOP
LFCSP
0
Figure 6. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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| ADA4853-3YRUZ-R7 | 功能描述:IC OPAMP VIDEO TRIPLE 14-TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 視頻放大器和頻緩沖器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 應(yīng)用:驅(qū)動(dòng)器 輸出類型:差分 電路數(shù):3 -3db帶寬:350MHz 轉(zhuǎn)換速率:1000 V/µs 電流 - 電源:14.5mA 電流 - 輸出 / 通道:60mA 電壓 - 電源，單路/雙路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安裝類型:表面貼裝 封裝/外殼:20-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-QFN 裸露焊盤(pán)（4x4） 包裝:帶卷 (TR) |
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| ADA4855-3 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Single Supply, High Speed, Rail-to-Rail Output, Triple Op Amp |
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