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參數資料
型號: ADA4311-1ARHZ
廠商: Analog Devices Inc
文件頁數: 12/16頁
文件大小: 0K
描述: IC LINE DRVR DUAL HI CURR 10MSOP
標準包裝: 50
放大器類型: 電流反饋
電路數: 2
轉換速率: 1050 V/µs
-3db帶寬: 310MHz
電流 - 輸入偏壓: 4.5µA
電壓 - 輸入偏移: 1000µV
電流 - 電源: 11.8mA
電壓 - 電源,單路/雙路(±): 6 V ~ 12 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 10-MSOP
包裝: 管件
ADA4311-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
13.6 V
Power Dissipation
(TJMAX TA)/θJA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Thermal resistance (θJA) is specified for the worst-case conditions,
that is, θJA is specified for device soldered in circuit board for
surface-mount packages.
Table 3.
Package Type
θJA
Unit
10-Lead MINI_SO_EP
44
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4311-1 is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 3 shows the maximum safe power dissipation in
the package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.
θJA values are approximations.
AMBIENT TEMPERATURE (°C)
M
A
X
IM
UM
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–35
–15
5
25
45
65
85
MINI_SO_EP-10
06
94
0-
00
3
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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