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參數資料
| 型號： | AD9445BSVZ-125 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | ADC |
| 英文描述： | 14-Bit, 105/125 MSPS, IF Sampling ADC |
| 中文描述： | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100 |
| 封裝： | LEAD FREE, PLASTIC, MS-026-AED, TQFP-100 |
| 文件頁數： | 8/40頁 |
| 文件大?。?/td> | 965K |
| 代理商： | AD9445BSVZ-125 |
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AD9445
ABSOLUTE MAXIMUM RATINGS
Table 5.
Rev. 0 | Page 8 of 40
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
With
Respect
To
AGND
AGND
DGND
DGND
DRVDD
DRVDD
AVDD1
DGND
AGND
AGND
Parameter
ELECTRICAL
AVDD1
AVDD2
DRVDD
AGND
AVDD1
AVDD2
AVDD2
D0± to D13±
CLK+/CLK
OUTPUT MODE, DCS
MODE, DFS, SFDR,
RF ENABLE
VIN+, VIN
VREF
SENSE
REFT, REFB
ENVIRONMENTAL
Storage Temperature
Range
Operating Temperature
Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
Rating
0.3 V to +4 V
0.3 V to +6 V
0.3 V to +4 V
0.3 V to +0.3 V
4 V to +4 V
4 V to +6 V
4 V to +6 V
–0.3 V to DRVDD + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
THERMAL RESISTANCE
The heat sink of the AD9445 package must be soldered to ground.
Table 6.
Package Type
θ
JA
100-lead TQFP/EP
19.8
Typical θ
JA
= 19.8°C/W (heat sink soldered) for multilayer
board in still air.
θ
JB
8.3
θ
JC
2
Unit
°C/W
AGND
AGND
AGND
AGND
–0.3 V to AVDD2 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–65°C to +125°C
Typical θ
JB
= 8.3°C/W (heat sink soldered) for multilayer board
in still air.
Typical θ
JC
= 2°C/W (junction to exposed heat sink) represents
the thermal resistance through heat sink path.
Airflow increases heat dissipation, effectively reducing θ
JA
. Also,
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θ
JA
. It is required that the exposed heat sink be soldered to
the ground plane.
–40°C to +85°C
300°C
150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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