參數(shù)資料
型號(hào)： AD9433BSVZ-125
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 18/20頁(yè)
文件大小： 0K
描述： IC ADC 12BIT 125MSPS 52-TQFP
標(biāo)準(zhǔn)包裝： 1
位數(shù)： 12
采樣率（每秒）： 125M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 1.43W
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 52-TQFP 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 52-TQFP-EP（10x10）
包裝： 托盤(pán)
輸入數(shù)目和類(lèi)型： 2 個(gè)單端，單極；2 個(gè)差分，單極
AD9433
Rev. A | Page 7 of 20
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
52
V
CC
51
GN
D
50
AI
N
49
AI
N
48
GN
D
47
V
CC
46
VR
E
F
O
U
T
45
VR
E
F
IN
44
V
CC
43
GN
D
42
S
F
DR
M
O
D
E
41
DF
S
40
GN
D
38
GND
37
VCC
36
VCC
33
GND
34
GND
35
GND
39
GND
32
VDD
31
DGND
30
D0 (LSB)
28
D2
27
D3
29
D1
2
VCC
3
GND
4
GND
7
ENCODE
6
VCC
5
VCC
1
GND
8
ENCODE
9
GND
10
VCC
12
DGND
13
VDD
11
GND
14
OR
15
D1
1(MS
B
)
16
D10
17
D9
18
D8
19
D7
20
D6
21
DG
ND
22
V
DD
23
V
DD
24
DG
ND
25
D5
26
D4
PIN 1
AD9433
TOP VIEW
(Not to Scale)
01
97
7-
0
02
NOTES
1. THE EXPOSED PADDLE ON THE UNDERSIDE OF THE PACKAGE MUST
BE SOLDERED TO THE GROUND PLANE. SOLDERING THE EXPOSED
PADDLE TO THE PCB INCREASES THE RELIABILITY OF THE SOLDER
JOINTS, MAXIMIZING THE THERMAL CAPABILITY OF THE PACKAGE.
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 3, 4, 9, 11, 33,
34, 35, 38, 39, 40,
43, 48, 51
GND
Analog Ground.
2, 5, 6, 10, 36, 37,
44, 47, 52
VCC
Analog Supply (5 V).
7
ENCODE
Encode Clock for ADC, Complementary.
8
ENCODE
Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.
12, 21, 24, 31
DGND
Digital Output Ground.
13, 22, 23, 32
VDD
Digital Output Power Supply (3 V).
14
OR
Out-of-Range Output.
15 to 20, 25 to 30
D11 to D6, D5 to D0
Digital Output.
41
DFS
Data Format Select. Logic low = twos complement, logic high = offset binary; floats low.
42
SFDR MODE
CMOS Control Pin. This pin enables SFDR mode, a proprietary circuit that can improve the SFDR
performance of the AD9433. SFDR mode is useful in applications where the dynamic range of
the system is limited by discrete spurious frequency content caused by nonlinearities in the
ADC transfer function. Set this pin to 0 for normal operation; floats low.
45
VREFIN
Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.
46
VREFOUT
Internal Reference Output (2.5 V Typical).
49
AIN
Analog Input, True.
50
AIN
Analog Input, Complementary.
Exposed Pad (EP)
The exposed paddle on the underside of the package must be soldered to the ground plane.
Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximiz-
ing the thermal capability of the package.
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