參數(shù)資料
型號: AD9273BBCZ-40
廠商: Analog Devices Inc
文件頁數(shù): 31/48頁
文件大?。?/td> 0K
描述: IC ADCASD OCTAL 25MSPS 144CSPBGA
標準包裝: 1
類型: AAF,ADC,交叉點開關(guān),LNA,VGA
分辨率(位): 12 b
采樣率(每秒): 40M
數(shù)據(jù)接口: 串行,SPI?
電壓電源: 模擬和數(shù)字
電源電壓: 1.8V,3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 144-LFBGA,CSPBGA
供應商設(shè)備封裝: 144-CSPBGA(10x10)
包裝: 托盤
AD9273
Rev. B | Page 37 of 48
Power and Ground Recommendations
When connecting power to the AD9273, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one 1.8 V supply is
available, it should be routed to the AVDD1 first and then
tapped off and isolated with a ferrite bead or a filter choke
preceded by decoupling capacitors for the DRVDD. The user
should employ several decoupling capacitors on all supplies to
cover both high and low frequencies. These should be located
close to the point of entry at the PC board level and close to the
parts with minimal trace lengths.
A single PC board ground plane should be sufficient when
using the AD9273. With proper decoupling and smart parti-
tioning of the PC board’s analog, digital, and clock sections,
optimum performance can be achieved easily.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the
device be connected to a quiet analog ground to achieve the
best electrical and thermal performance of the AD9273. An
exposed continuous copper plane on the PCB should mate to
the AD9273 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be filled or plugged with nonconductive epoxy.
To maximize the coverage and adhesion between the device and
PCB, partition the continuous copper pad by overlaying a silk-
screen or solder mask to divide this into several uniform sections.
This ensures several tie points between the two during the reflow
process. Using one continuous plane with no partitions only
guarantees one tie point between the AD9273 and PCB. See
Figure 68 for a PCB layout example. For more detailed infor-
mation on packaging and for more PCB layout examples, see
the AN-772 Application Note.
SILKSCREEN PARTITION
PIN 1 INDICATOR
07
03
0-
06
9
Figure 68. Typical PCB Layout
相關(guān)PDF資料
PDF描述
LTC6905HS5-96#TRMPBF IC OSC SILICON 96MHZ TSOT23-5
V28A24M200B CONVERTER MOD DC/DC 24V 200W
LTC6908CS6-1#TRPBF IC OSC SILICON 10MHZ TSOT23-6
LTC6908CS6-2#TRPBF IC OSC SILICON 10MHZ TSOT23-6
AD7874AR IC DAS 12BIT 4CH LC2MOS 28-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD9273BBCZ-50 功能描述:IC ADCASD OCTAL 25MSPS 144CSPBGA RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤
AD9273BSVZ-25 功能描述:IC ADC OCT 12BIT 25MSPS 100-TQFP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤
AD9273BSVZ-40 功能描述:IC ADC OCT 12BIT 40MSPS 100-TQFP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤
AD9273BSVZ-50 功能描述:IC ADC ASD OCTAL 50MSPS 100-TQFP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤
AD9273BSVZRL-25 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12Bit 25 MSPS Octal ADC RoHS:否 制造商:Analog Devices 通道數(shù)量: 結(jié)構(gòu): 轉(zhuǎn)換速率: 分辨率: 輸入類型: 信噪比: 接口類型: 工作電源電壓: 最大工作溫度: 安裝風格: 封裝 / 箱體: