參數(shù)資料
型號(hào)： AD9271BSVZRL-50
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 12/60頁(yè)
文件大小： 0K
描述： IC ADC OCT 12BIT 50MSPS 100-TQFP
標(biāo)準(zhǔn)包裝： 1,000
位數(shù)： 12
采樣率（每秒）： 50M
數(shù)據(jù)接口： 串行，SPI?
轉(zhuǎn)換器數(shù)目： 8
功率耗散（最大）： 1.49W
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 100-TQFP 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 100-TQFP-EP（14x14）
包裝： 帶卷 (TR)
輸入數(shù)目和類(lèi)型： 8 個(gè)單端，單極；8 個(gè)差分，單極
AD9271
Rev. B | Page 2 of
60
TABLE OF CONTENTS
REVISION HISTORY
5/09—Rev. A to Rev. B
Changes to Figure 27...................................................................... 17
Changes to Figure 40 and Figure 41............................................. 21
Changes to Ordering Guide .......................................................... 58
12/07—Rev. 0 to Rev. A
Change to AC Specifications Text .................................................. 4
Added Input Noise Current ............................................................ 4
Added Noise Figure.......................................................................... 4
Changes to Signal-to-Noise Ratio Units........................................ 4
Changes to Harmonic Distortion Units ........................................ 5
Added Endnote 3 .............................................................................. 6
Changes to Table 6.......................................................................... 11
Inserted Figure 19 and Figure 21.................................................. 16
Changes to Figure 20...................................................................... 16
Changes to Theory of Operation Section.................................... 20
Changes to Figure 40 and Figure 41............................................. 21
Change to Active Impedance Matching Section ........................ 22
Changes to LNA Noise Section .................................................... 22
Changes to Figure 43...................................................................... 22
Change to Input Overload Protection Section ........................... 23
Changes to TGC Operation Section ............................................ 25
Changes to Gain Control Section................................................. 26
Changes to Figure 52...................................................................... 26
Change to Table 11 ......................................................................... 33
Changes to Serial Interface Port (SPI) Section ........................... 35
Changes to Hardware Interface Section ...................................... 35
Changes to Reading the Memory Map Table Section ............... 37
Added Applications Information and
Design Guidelines Sections...................................................... 41
Change to Input Signals Section................................................... 42
Changes to Figure 73...................................................................... 42
Changes to Table 16 ....................................................................... 55
6/07—Revision 0: Initial Version
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