參數(shù)資料
型號(hào)： AD9233BCPZRL7-125
廠商： Analog Devices Inc
文件頁數(shù)： 43/44頁
文件大?。?/td> 0K
描述： IC ADC 12BIT 125MSPS 48-LFCSP
標(biāo)準(zhǔn)包裝： 750
位數(shù)： 12
采樣率（每秒）： 125M
數(shù)據(jù)接口： 串行，SPI?
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 425mW
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 48-LFCSP-VQ（7x7）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 2 個(gè)單端，單極；1 個(gè)差分，單極
配用： AD9233-125EBZ-ND - BOARD EVALUATION FOR AD9233
AD9233
Rev. A | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
ELECTRICAL
AVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +3.9 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
D0 through D11 to DRGND
0.3 V to DRVDD + 0.3 V
DCO to DRGND
0.3 V to DRVDD + 0.3 V
OR to DRGND
0.3 V to DRVDD + 0.3 V
CLK+ to AGND
0.3 V to +3.9 V
CLK to AGND
0.3 V to +3.9 V
VIN+ to AGND
0.3 V to AVDD + 1.3 V
VIN to AGND
0.3 V to AVDD + 1.3 V
VREF to AGND
0.3 V to AVDD + 0.2 V
SENSE to AGND
0.3 V to AVDD + 0.2 V
REFT to AGND
0.3 V to AVDD + 0.2 V
REFB to AGND
0.3 V to AVDD + 0.2 V
SDIO/DCS to DRGND
0.3 V to DRVDD + 0.3 V
PDWN to AGND
0.3 V to +3.9 V
CSB to AGND
0.3 V to +3.9 V
SCLK/DFS to AGND
0.3 V to +3.9 V
OEB to AGND
0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature
(Soldering 10 Sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
θJA
θJC
Unit
48-lead LFCSP (CP-48-3)
26.4
2.4
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes,
reduces the θJA.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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