參數(shù)資料
型號(hào): AD8608AR-REEL7
廠商: ANALOG DEVICES INC
元件分類: 運(yùn)動(dòng)控制電子
英文描述: Precision Low noise CMOS Rail-to-Rail Input/Output Operational Amplifiers
中文描述: QUAD OP-AMP, 750 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO14
封裝: MS-012AB, SOIC-14
文件頁數(shù): 18/20頁
文件大?。?/td> 559K
代理商: AD8608AR-REEL7
AD8605/AD8606/AD8608
OUTLINE DIMENSIONS
Rev. D | Page 18 of 20
PIN 1
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
1
3
4
5
2
0.22
0.08
10°
0.50
0.30
0.15 MAX
SEATING
PLANE
1.45 MAX
1.30
1.15
0.90
2.90 BSC
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178AA
Figure 57. 5-Lead Small Outline Transistor Package [SOT-23] (RT-5)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COPLANARITY
0.10
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012AB
×
45°
Figure 58. 14-Lead Standard Small Outline Package [SOIC]
Narrow Body (R-14)
0.80
0.60
0.40
4
8
5
4.90
BSC
PIN 1
0.65 BSC
3.00
BSC
SEATING
PLANE
0.15
0.00
0.38
0.22
1.10 MAX
3.00
BSC
COPLANARITY
0.10
0.23
0.08
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 59. 8-Lead Mini Small Outline Package [MSOP] (RM-8)
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
×
45°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00(0.1968)
4.80(0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AA
Figure 60. 8-Lead Standard Small Outline Package [SOIC] Narrow Body (R-8)
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65
BSC
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 61. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14)
SEATING
0.50 REF
0.87
0.37
0.36
0.35
0.17
0.14
0.12
0.21
0.50
0.20
0.50
0.23
0.18
0.14
BOTTOM VIEW
0.94
0.90
0.86
1.33
1.29
1.25
TOP VIEW
(BALL SIDE DOWN)
IDENTPIN 1
Figure 62. 5-Bump 2 × 1 × 2 Array MicroCSP [WLCSP] (CB-5)
相關(guān)PDF資料
PDF描述
AD8608ARU-REEL Precision Low noise CMOS Rail-to-Rail Input/Output Operational Amplifiers
AD8607ARM-REEL Precision Micropower Low Noise CMOS Rail-Rail Input/Output Operational Amplifiers
AD8609 Precision Micropower Low Noise CMOS Rail-Rail Input/Output Operational Amplifiers
AD8609AR Precision Micropower Low Noise CMOS Rail-Rail Input/Output Operational Amplifiers
AD8609AR-REEL Precision Micropower Low Noise CMOS Rail-Rail Input/Output Operational Amplifiers
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