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參數資料
| 型號： | AD8337BCPZ-WP |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 18/32頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP VGA DC-COUPLED GP 8-LFCSP |
| 標準包裝： | 50 |
| 系列： | X-AMP® |
| 類型： | 可變增益放大器 |
| 應用： | 信號處理 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFDFN 裸露焊盤，CSP |
| 供應商設備封裝： | 8-LFCSP-VD（3x3） |
| 包裝： | 托盤 - 晶粒 |
| 產品目錄頁面： | 775 (CN2011-ZH PDF) |
| 配用： | AD8337-EVALZ-SS-ND - BOARD EVALUATION FOR AD8337 SS AD8337-EVALZ-INV-ND - BOARD EVALUATION FOR AD8337 INS AD8337-EVALZ-ND - BOARD EVALUATION FOR AD8337 |
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AD8337
Rev. C | Page 25 of
32
POWER SUPPLY
+5V
TOP:
SIGNAL GENERATOR 10.05MHz, 500mV p-p
BOTTOM:
SIGNAL GENERATOR 9.95MHz, 500mV p-p
SIGNAL
INPUT
–5V
POWER
SPLITTER
PREAMP
OUTPUT
VGAIN
POWER
AMPLIFIERS
SPECTRUM
ANALYZER
05
57
5-
1
83
Figure 83. Typical Board Test Connections
MEASUREMENT SETUP
Figure 83 shows board connections for two generators. In this
example, the experiment illustrates IMD measurements using
standard off-the-shelf test equipment used by Analog Devices.
However, any equivalent equipment can be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
layouts.
For ease of assembly, all board components are located on the
primary side and are 0603 size surface mounts. Higher density
applications may require components on both sides of the board
and present no problem to the AD8337, as demonstrated in
unreleased versions of the board that featured secondary-side
components and vias. Not evident in the figures are thermal
vias within the pad that solder to the mating pad of the AD8337
chip-scale package. These vias serve as a thermal path and are
the primary means of removing heat from the device. The thermal
specifications for the AD8337 are predicated on the use of multi-
layer board construction with these thermal vias to enable heat
conductivity from the die.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| AD8337-EVAL-INV | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| AD8337-EVAL-SS | 制造商:Analog Devices 功能描述: |
| AD8337-EVALZ | 功能描述:BOARD EVALUATION FOR AD8337 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運算放大器 系列:X-AMP® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
| AD8337-EVALZ-INV | 功能描述:BOARD EVALUATION FOR AD8337 INS RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運算放大器 系列:X-AMP® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
| AD8337-EVALZ-SS | 功能描述:BOARD EVALUATION FOR AD8337 SS RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運算放大器 系列:X-AMP® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
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