參數(shù)資料
型號(hào)： AD8337BCPZ-R2
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 18/32頁(yè)
文件大?。?/td> 0K
描述： IC AMP VGA LOW NOISE 8-LFCSP
標(biāo)準(zhǔn)包裝： 1
系列： X-AMP®
類型： 可變?cè)鲆娣糯笃?br>
應(yīng)用： 信號(hào)處理
安裝類型： 表面貼裝
封裝/外殼： 8-VFDFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 8-LFCSP-VD（3x3）
包裝： 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面： 775 (CN2011-ZH PDF)
配用： AD8337-EVALZ-SS-ND - BOARD EVALUATION FOR AD8337 SS
AD8337-EVALZ-INV-ND - BOARD EVALUATION FOR AD8337 INS
AD8337-EVALZ-ND - BOARD EVALUATION FOR AD8337
其它名稱： AD8337BCPZ-R2DKR
AD8337
Rev. C | Page 25 of
32
POWER SUPPLY
+5V
TOP:
SIGNAL GENERATOR 10.05MHz, 500mV p-p
BOTTOM:
SIGNAL GENERATOR 9.95MHz, 500mV p-p
SIGNAL
INPUT
–5V
POWER
SPLITTER
PREAMP
OUTPUT
VGAIN
POWER
AMPLIFIERS
SPECTRUM
ANALYZER
05
57
5-
1
83
Figure 83. Typical Board Test Connections
MEASUREMENT SETUP
Figure 83 shows board connections for two generators. In this
example, the experiment illustrates IMD measurements using
standard off-the-shelf test equipment used by Analog Devices.
However, any equivalent equipment can be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes. Figure 84 through Figure 88 show the copper
layouts.
For ease of assembly, all board components are located on the
primary side and are 0603 size surface mounts. Higher density
applications may require components on both sides of the board
and present no problem to the AD8337, as demonstrated in
unreleased versions of the board that featured secondary-side
components and vias. Not evident in the figures are thermal
vias within the pad that solder to the mating pad of the AD8337
chip-scale package. These vias serve as a thermal path and are
the primary means of removing heat from the device. The thermal
specifications for the AD8337 are predicated on the use of multi-
layer board construction with these thermal vias to enable heat
conductivity from the die.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD8337BCPZ-REEL 功能描述:IC AMP VGA LOW NOISE 8-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤
AD8337BCPZ-REEL7 功能描述:IC AMP VGA LOW NOISE 8-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤
AD8337BCPZWP 制造商:Analog Devices 功能描述:IC,Voltage Controlled Gain Amplifier,SINGLE,LLCC,8PIN
AD8337BCPZ-WP 功能描述:IC AMP VGA DC-COUPLED GP 8-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤
AD8337-EVAL-INV 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述:
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