參數(shù)資料
型號(hào)： AD8337-EVALZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 18/32頁(yè)
文件大?。?/td> 0K
描述： BOARD EVALUATION FOR AD8337
標(biāo)準(zhǔn)包裝： 1
系列： X-AMP®
每 IC 通道數(shù)： 1 - 單
放大器類型： 電壓反饋
輸出類型： 單端
轉(zhuǎn)換速率： 625 V/µs
-3db帶寬： 280MHz
工作溫度： -40°C ~ 85°C
電流供應(yīng)（主 IC）： 18.5mA
電壓 - 電源，單路/雙路(±)： ±2.5 V ~ 5 V
板類型： 完全填充
已供物品： 板
已用 IC / 零件： AD8337
產(chǎn)品目錄頁(yè)面： 775 (CN2011-ZH PDF)
相關(guān)產(chǎn)品： AD8337BCPZ-REEL7-ND - IC AMP VGA LOW NOISE 8-LFCSP
AD8337BCPZ-REEL-ND - IC AMP VGA LOW NOISE 8-LFCSP
AD8337BCPZ-WP-ND - IC AMP VGA DC-COUPLED GP 8-LFCSP
AD8337BCPZ-R2DKR-ND - IC AMP VGA LOW NOISE 8-LFCSP
AD8337BCPZ-R2CT-ND - IC AMP VGA LOW NOISE 8-LFCSP
AD8337BCPZ-R2TR-ND - IC AMP VGA LOW NOISE 8-LFCSP
AD8337
Rev. C | Page 25 of
32
POWER SUPPLY
+5V
TOP:
SIGNAL GENERATOR 10.05MHz, 500mV p-p
BOTTOM:
SIGNAL GENERATOR 9.95MHz, 500mV p-p
SIGNAL
INPUT
–5V
POWER
SPLITTER
PREAMP
OUTPUT
VGAIN
POWER
AMPLIFIERS
SPECTRUM
ANALYZER
05
57
5-
1
83
Figure 83. Typical Board Test Connections
MEASUREMENT SETUP
Figure 83 shows board connections for two generators. In this
example, the experiment illustrates IMD measurements using
standard off-the-shelf test equipment used by Analog Devices.
However, any equivalent equipment can be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes. Figure 84 through Figure 88 show the copper
layouts.
For ease of assembly, all board components are located on the
primary side and are 0603 size surface mounts. Higher density
applications may require components on both sides of the board
and present no problem to the AD8337, as demonstrated in
unreleased versions of the board that featured secondary-side
components and vias. Not evident in the figures are thermal
vias within the pad that solder to the mating pad of the AD8337
chip-scale package. These vias serve as a thermal path and are
the primary means of removing heat from the device. The thermal
specifications for the AD8337 are predicated on the use of multi-
layer board construction with these thermal vias to enable heat
conductivity from the die.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD8337-EVALZ-INV 功能描述:BOARD EVALUATION FOR AD8337 INS RoHS:是 類別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:-
AD8337-EVALZ-SS 功能描述:BOARD EVALUATION FOR AD8337 SS RoHS:是 類別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:-
AD8338 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power, 18 MHz Variable Gain Amplifier
AD8338ACPZ-R7 功能描述:特殊用途放大器 Ultra Low Pwr 18MHz SGL CH VGA RoHS:否 制造商:Analog Devices 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:5 V 電源電流:133 mA 最大功率耗散:900 mW 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSSOP-28 封裝:Reel
AD8338ACPZ-RL 制造商:Analog Devices 功能描述:AMPLIFIER - SPECIAL PURPOSE
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