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    • 參數(shù)資料
      型號(hào): AD8276ARZ-RL
      廠(chǎng)商: Analog Devices Inc
      文件頁(yè)數(shù): 16/20頁(yè)
      文件大?。?/td> 0K
      描述: IC AMP DIFF R-R 550KHZ LP 8SOIC
      設(shè)計(jì)資源: High Precision, Low Cost Current Sources Using AD8276 and AD8603 (CN0099)
      標(biāo)準(zhǔn)包裝: 2,500
      放大器類(lèi)型: 差分
      電路數(shù): 1
      輸出類(lèi)型: 滿(mǎn)擺幅
      轉(zhuǎn)換速率: 1.1 V/µs
      增益帶寬積: 550kHz
      電壓 - 輸入偏移: 100µV
      電流 - 電源: 200µA
      電流 - 輸出 / 通道: 15mA
      電壓 - 電源,單路/雙路(±): 2 V ~ 36 V,±2 V ~ 18 V
      工作溫度: -40°C ~ 85°C
      安裝類(lèi)型: 表面貼裝
      封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
      供應(yīng)商設(shè)備封裝: 8-SO
      包裝: 帶卷 (TR)
      Data Sheet
      AD8276/AD8277
      Rev. C | Page 5 of 20
      ABSOLUTE MAXIMUM RATINGS
      Table 4.
      Parameter
      Rating
      Supply Voltage
      ±18 V
      Maximum Voltage at Any Input Pin
      VS + 40 V
      Minimum Voltage at Any Input Pin
      +VS 40 V
      Storage Temperature Range
      65°C to +150°C
      Specified Temperature Range
      40°C to +85°C
      Package Glass Transition Temperature (TG)
      150°C
      Stresses above those listed under Absolute Maximum Ratings
      may cause permanent damage to the device. This is a stress
      rating only; functional operation of the device at these or any
      other conditions above those indicated in the operational
      section of this specification is not implied. Exposure to absolute
      maximum rating conditions for extended periods may affect
      device reliability.
      THERMAL RESISTANCE
      The θJA values in Table 5 assume a 4-layer JEDEC standard
      board with zero airflow.
      Table 5.
      Package Type
      θJA
      Unit
      8-Lead MSOP
      135
      °C/W
      8-Lead SOIC
      121
      °C/W
      14-Lead SOIC
      105
      °C/W
      MAXIMUM POWER DISSIPATION
      The maximum safe power dissipation for the AD8276/AD8277
      is limited by the associated rise in junction temperature (TJ) on
      the die. At approximately 150°C, which is the glass transition
      temperature, the properties of the plastic change. Even temporarily
      exceeding this temperature limit may change the stresses that the
      package exerts on the die, permanently shifting the parametric
      performance of the amplifiers. Exceeding a temperature of 150°C
      for an extended period may result in a loss of functionality.
      2.0
      1.6
      1.2
      0.8
      0.4
      0
      –50
      0
      –25
      25
      50
      75
      100
      125
      MA
      XI
      MU
      M
      P
      O
      W
      E
      R
      D
      IS
      S
      IPA
      T
      IO
      N
      (W
      )
      AMBIENT TEMERATURE (°C)
      TJ MAX = 150°C
      8-LEAD MSOP
      θJA = 135°C/W
      8-LEAD SOIC
      θJA = 121°C/W
      07
      69
      2-
      00
      2
      14-LEAD SOIC
      θJA = 105°C/W
      Figure 3. Maximum Power Dissipation vs. Ambient Temperature
      SHORT-CIRCUIT CURRENT
      The AD8276/AD8277 have built-in, short-circuit protection
      that limits the output current (see Figure 25 for more information).
      While the short-circuit condition itself does not damage the
      part, the heat generated by the condition can cause the part to
      exceed its maximum junction temperature, with corresponding
      negative effects on reliability. Figure 3 and Figure 25, combined
      with knowledge of the supply voltages and ambient temperature of
      the part, can be used to determine whether a short circuit will
      cause the part to exceed its maximum junction temperature.
      ESD CAUTION
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