參數(shù)資料
型號(hào)： AD822AR
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 12/24頁(yè)
文件大?。?/td> 0K
描述： IC OPAMP GP R-R 1.9MHZ LP 8SOIC
設(shè)計(jì)資源： 16-Bit Fully Isolated 4 mA to 20 mA Output Module Using AD5662, ADuM1401, and External Amplifiers (CN0064)
標(biāo)準(zhǔn)包裝： 98
放大器類(lèi)型： 通用
電路數(shù)： 2
輸出類(lèi)型： 滿擺幅
轉(zhuǎn)換速率： 3 V/µs
增益帶寬積： 1.9MHz
-3db帶寬： 1.9MHz
電流 - 輸入偏壓： 2pA
電壓 - 輸入偏移： 400µV
電流 - 電源： 1.4mA
電流 - 輸出 / 通道： 20mA
電壓 - 電源，單路/雙路(±)： 3 V ~ 36 V，±1.5 V ~ 18 V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SO
包裝： 管件
AD822
Rev. I | Page 2 of 24
TABLE OF CONTENTS
REVISION HISTORY
1/10—Rev. H to Rev. I
Changes to Features Section and General Description Section . 1
Changes to Endnote 1, Table 1........................................................ 5
Changes to Endnote 1, Table 2........................................................ 7
Changes to Endnote 1, Table 3........................................................ 9
Deleted Table 4; Renumbered Sequentially ................................ 10
Changes to Table 5.......................................................................... 12
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 22
Deleted 3 V, Single-Supply Stereo Headphone Driver Section. 22
Deleted Figure 50; Renumbered Sequentially ............................ 22
8/08—Rev. G to Rev H.
Changes to Features Section and General Description Section . 1
Changed VO to VOUT Throughout................................................... 4
Changes to Table 1............................................................................ 4
Changes to Table 2............................................................................ 6
Changes to Table 3............................................................................ 8
Changes to Table 5.......................................................................... 12
Added Table 6; Renumbered Sequentially .................................. 12
Changes to Figure 13 Caption....................................................... 14
Changes to Figure 29, Figure 31, and Figure 35 ......................... 17
Changes to Figure 36...................................................................... 18
Changed Application Notes Section to Applications
Information Section ....................................................................... 20
Changes to Figure 46 and Figure 47............................................. 21
Changes to Figure 49...................................................................... 22
Changes to Figure 51...................................................................... 23
6/06—Rev. F to Rev. G
Changes to Features ..........................................................................1
Changes to Table 4.......................................................................... 10
Changes to Table 5.......................................................................... 12
Changes to Table 6.......................................................................... 22
10/05—Rev. E to Rev. F
Updated Format..................................................................Universal
Changes to Outline Dimensions .................................................. 24
Updated Ordering Guide .............................................................. 24
1/03—Data sheet changed from Rev. D to Rev. E
Edits to Specifications .......................................................................2
Edits to Figure 10............................................................................ 16
Updated Outline Dimensions....................................................... 17
10/02—Data sheet changed from Rev. C to Rev. D
Edits to Features.................................................................................1
Edits to Ordering Guide ...................................................................6
Updated SOIC Package Outline ................................................... 17
8/02—Data sheet changed from Rev. B to Rev. C
All Figures Updated ................................................................Global
Edits to Features.................................................................................1
Updated All Package Outlines ...................................................... 17
7/01—Data sheet changed from Rev. A to Rev. B
All Figures Updated ................................................................Global
CERDIP References Removed.......................................1, 6, and 18
Additions to Product Description...................................................1
8-Lead SOIC and 8-Lead MSOP Diagrams Added ......................1
Deletion of AD822S Column...........................................................2
Edits to Absolute Maximum Ratings and Ordering Guide .........6
Removed Metallization Photograph ...............................................6
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