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ABSOLUT E MAX IMUM RAT INGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V
Internal Power Dissipation
2
AD8184 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts
AD8184 14-Lead Small Outline (R) . . . . . . . . . . 1.0 Watts
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
V
S
Output Short Circuit Duration . . Observe Power Derating Curves
Storage T emperature Range
N & R Package . . . . . . . . . . . . . . . . . . . . . –65
°
C to +125
°
C
Lead T emperature Range (Soldering 10 sec) . . . . . . . +300
°
C
NOT ES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. T his is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air: 14-pin plastic package:
θ
JA
= 75
°
C/Watt
14-pin SOIC package:
θ
JA
= 120
°
C/Watt, where P
D
= (T
J
–T
A
)/
θ
JA
.
ORDE RING GUIDE
T emperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Evaluation Board For AD8184R
Package
Description
14-Lead Plastic DIP
14-Lead Narrow SOIC R-14
Reel 14-Lead SOIC
Package
Option
N-14
Model
AD8184AN
AD8184AR
AD8184AR-REEL
AD8184-EB
R-14
MAX IMUM POWE R DISSIPAT ION
T he maximum power that can be safely dissipated by the AD8184
is limited by the associated rise in junction temperature. T he maxi-
mum safe junction temperature for plastic encapsulated devices is
determined by the glass transition temperature of the plastic,
approximately +150
°
C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175
°
C for an extended period can result in
device failure.
NOT ES
1
ENABLE
pin is grounded. IN0 and IN2 = +1 V dc, IN1 and IN3 = –1 V dc. A0 is driven with a 0 V to +5 V pulse, A1 is grounded. Measure transition time from 50% of the A0
input value (+2.5 V) and 10% (or 90%) of the total output voltage transition from IN0 channel voltage (+1 V) to IN1 (–1 V), or vice versa. All inputs are measured in a similar
manner using A0 and A1 to select the channels.
2
ENABLE
pin is driven with 0 V to +5 V pulse (with 3 ns edges). T he state of the A0 and A1 pins determines which input is activated (refer to T able I). Set IN0 and IN2 = +1 V dc,
IN1 and IN3 = –1 V dc, and measure transition time from 50% of
ENABLE
pulse (+2.5 V) to 90% of the total output voltage change. In Figure 4,
t
OFF
is the disable time,
t
ON
is the enable time.
3
All inputs are grounded. A0 input is driven with 0 V to +5 V pulse, A1 is grounded. T he output is monitored. Speeding the edges of the A0 pulse increases the glitch magnitude
due to coupling via the ground plane. Removing the A0 and A1 terminations will lower the glitch, as does increasing R
L
.
4
Decreasing R
L
slightly lowers the bandwidth. Increasing C
significantly lowers the bandwidth (see Figure 18).
5
A resistor (R
) placed in series with the multiplexer inputs serves to optimize 0.1 dB flatness, but is not required (see Figure 19.)
6
Select an input that is not being driven (i.e., A0 and A1 are logic 0, IN0 is selected); drive all other inputs with V
IN
= 0.707 V rms and monitor the output at = 5 and 30 MHz.
R
= 2 k
(see Figure 12).
7
Multiplexer is disabled (i.e.,
ENABLE
= logic 1) and all inputs are driven simultaneously with V
= 0.446 V rms. Output is monitored at = 5 and 30 MHz. R
= 30
to simu-
late R
of one enabled multiplexer within a system (see Figure 13). In this mode the output impedance is very high (typ 10 M
), and the signal couples across the package; the
load impedance determines the crosstalk.
8
Voltage gain decreases for lower values of R
. T he resistive divider formed by the multiplexers enables output resistance (28
) and R
L
causes a gain that increases as R
L-
decreases (i.e., the voltage gain is approximately 0.97 V/V [3% gain error] for R
= 1 k
).
9
Larger values of R
L
provide wider output voltage swings, as well as better gain accuracy. See Note 8.
Specifications subject to change without notice.
AD8184
–3–
REV. 0
While the AD8184 is internally short circuit protected, this may
not be sufficient to guarantee that the maximum junction tempera-
ture (+150
°
C) is not exceeded under all conditions. T o ensure
proper operation, it is necessary to observe the maximum power
derating curves shown in Figure 2.
AMBIENT TEMPERATURE –
°
C
2.5
2.0
0.5
–50
90
–40
M
–30 –20 –10
0
10 20
30
40 50
60
80
1.5
1.0
70
14-PIN SOIC
14-PIN DIP PACKAGE
T
J
= +150
°
C
Figure 2. Maximum Power Dissipation vs. Temperature
WARNING!
ESD SENSITIVE DEVICE
CAUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8184 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.