- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄5416 > AD8137YCPZ-REEL (Analog Devices Inc)IC AMP DIFF R-R LP 20MA 8LFCSP PDF資料下載
參數(shù)資料
| 型號： | AD8137YCPZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 2/33頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP DIFF R-R LP 20MA 8LFCSP |
| 標(biāo)準(zhǔn)包裝： | 5,000 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分，滿擺幅 |
| 轉(zhuǎn)換速率： | 450 V/µs |
| -3db帶寬： | 110MHz |
| 電流 - 輸入偏壓： | 500nA |
| 電壓 - 輸入偏移： | 700µV |
| 電流 - 電源： | 3.2mA |
| 電流 - 輸出 / 通道： | 20mA |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 12 V，± 2.7 V ~ 6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFDFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 8-LFCSP-VD（3x3） |
| 包裝： | 帶卷 (TR) |
第1頁當(dāng)前第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁
Data Sheet
AD8137
Rev. E | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
12 V
VOCM
VS+ to VS
Power Dissipation
Input Common-Mode Voltage
VS+ to VS
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for the device soldered in a circuit board in still air.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC/2-Layer
157
56
°C/W
8-Lead SOIC/4-Layer
125
56
°C/W
8-Lead LFCSP/4-Layer
70
56
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8137 package
is limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit may change the stresses that
the package exerts on the die, permanently shifting the parametric
performance of the AD8137. Exceeding a junction temperature
of 175°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The load current consists of differential
and common-mode currents flowing to the load, as well as
currents flowing through the external feedback networks and
the internal common-mode feedback loop. The internal resistor
tap used in the common-mode feedback loop places a 1 k
differential load on the output. RMS output voltages should be
considered when dealing with ac signals.
Airflow reduces θJA. In addition, more metal directly in contact
with the package leads from metal traces, through holes, ground,
and power planes reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 8-lead SOIC
(125°C/W) and 8-lead LFCSP (θJA = 70°C/W) on a JEDEC
standard 4-layer board. θJA values are approximations.
–40
–20 –10
–30
0
10 20 30 40 50 60 70 80 90 100 110 120
3.0
MAXIMUM
POWER
DISSIPATION
(W)
1.0
1.5
0.5
2.0
2.5
0
AMBIENT TEMPERATURE (°C)
SOIC-8
LFCSP
04771-0-022
Figure 3. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 3412.0123.24 | FUSE 4A 32V 0603 FAST |
| AD8602DR-REEL | IC OPAMP GP CMOS 8.4MHZ 8SOIC |
| AD8033ARZ-REEL | IC OPAMP VF R-R LN LP 60MA 8SOIC |
| LT1722IS8#TRPBF | IC PREC OPAMP 200MHZ SNGL 8-SOIC |
| AD8602DR | IC OPAMP GP CMOS 8.4MHZ 8SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD8137YCPZ-REEL7 | 功能描述:IC AMP DIFF R-R LP 20MA 8LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
| AD8137YR | 功能描述:IC AMP DIFF R-R LP 20MA 8SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:通用 電路數(shù):1 輸出類型:滿擺幅 轉(zhuǎn)換速率:3 V/µs 增益帶寬積:10MHz -3db帶寬:- 電流 - 輸入偏壓:1pA 電壓 - 輸入偏移:70µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:48mA 電壓 - 電源，單路/雙路(±):2.7 V ~ 5.5 V，±1.35 V ~ 2.75 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 供應(yīng)商設(shè)備封裝:SOT-6 包裝:Digi-Reel® 其它名稱:MAX4475AUT#TG16DKR |
| AD8137YR-EBZ | 功能描述:BOARD EVAL FOR AD8137YR RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| AD8137YR-REEL | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single R-R O/P |
| AD8137YR-REEL7 | 功能描述:IC AMP DIFF R-R LP 20MA 8SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:帶卷 (TR) |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。