參數(shù)資料
型號: AD8005ARZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大?。?/td> 0K
描述: IC OPAMP CF ULP LDIST 10MA 8SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 電流反饋
電路數(shù): 1
轉(zhuǎn)換速率: 1500 V/µs
-3db帶寬: 270MHz
電流 - 輸入偏壓: 5µA
電壓 - 輸入偏移: 5000µV
電流 - 電源: 400µA
電流 - 輸出 / 通道: 10mA
電壓 - 電源,單路/雙路(±): 4 V ~ 12 V,±2 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 帶卷 (TR)
Data Sheet
AD8005
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
12.6 V
Internal Power Dissipation1
PDIP Package (N-8)
1.3 Watts
SOIC_N (R-8)
0.75 Watts
SOT-23 Package (RJ-5)
0.5 Watts
Input Voltage (Common Mode)
±VS ± 1 V
Differential Input Voltage
±3.5 V
Output Short Circuit Duration
Observe Power Derating Curves
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature Range
(Soldering 10 sec)
+300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for device in free air.
Table 4. Thermal Resistance
Package Type
θJA
Unit
8-Lead PDIP Package
90
°C/W
8-Lead SOIC_N Package
155
°C/W
5-Lead SOT-23 Package
240
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8005
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately +150°C. Exceeding this limit temporarily
causes a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175°C for an extended period can result in
device failure.
While the AD8005 is internally short circuit protected, this is
not sufficient to guarantee that the maximum junction temper-
ature (+150°C) is not exceeded under all conditions. To ensure
proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 5.
Figure 5. Maximum Power Dissipation vs. Temperature
ESD CAUTION
–50
–30
–10
1030507090
–40
–20
0
20406080
MA
XI
MU
M
PO
W
E
R
D
ISS
IP
A
T
IO
N
(W
)
AMBIENT TEMPERATURE (°C)
TJ = 150°C
2.0
1.5
1.0
0.5
0
8-LEAD PDIP PACKAGE
8-LEAD SOIC_N PACKAGES
5-LEAD SOT-23 PACKAGE
121
46-
005
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