參數(shù)資料
型號: AD7986BCPZ
廠商: Analog Devices Inc
文件頁數(shù): 27/28頁
文件大小: 0K
描述: IC ADC 18BIT 2MSPS SAR 20LFCSP
產(chǎn)品培訓(xùn)模塊: Motor Control
標(biāo)準(zhǔn)包裝: 1
位數(shù): 18
采樣率(每秒): 2M
數(shù)據(jù)接口: MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 34mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 20-LFCSP-VQ
包裝: 托盤
輸入數(shù)目和類型: 1 個差分,雙極
產(chǎn)品目錄頁面: 780 (CN2011-ZH PDF)
AD7986
Rev. B | Page 8 of 28
Pin No.
Mnemonic
Type1
Description
16
AVDD
P
Input Analog Power. Nominally at 2.5 V.
17,18
AGND
P
Analog Power Ground.
19
BVDD
P
Reference buffer power. Nominally 5.0 V.
If an external reference buffer is used to achieve the maximum SNR performance with 5 V reference,
the reference buffer must be powered down by connecting the REFIN pin to ground. The external
reference buffer must be connected to the BVDD pin.
20
REFIN
AI/O
Internal Reference Output/Reference Buffer Input.
When PDREF = low, the internal band gap reference produces a 1.2 V (typical) voltage on this pin,
which needs external decoupling (0.1 F typical).
When PDREF = high, use an external reference to provide a 1.2 V (typical) to this pin.
When PDREF = high, and REFIN = low, the on-chip reference buffer and band gap are powered down.
An external reference must be connected to REF and BVDD.
21 (EPAD)
Exposed Pad
EP
The exposed pad is not connected internally. For increased reliability of the solder joints, it is
recommended that the pad be soldered to the system ground plane.
1 AI = analog input, AI/O = bidirectional analog; DI = digital input, DO = digital output, and P = power.
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