參數(shù)資料
型號(hào): AD7985BCPZ-RL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 27/28頁(yè)
文件大?。?/td> 0K
描述: IC ADC 16B 2.5MSPS PULSR 20LFCSP
標(biāo)準(zhǔn)包裝: 1,500
系列: PulSAR®
位數(shù): 16
采樣率(每秒): 2.5M
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 33mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 20-LFCSP-VQ
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)偽差分,單極
AD7985
Rev. A | Page 8 of 28
Pin No.
Mnemonic
Type1
Description
19
BVDD
P
Reference Buffer Power. Nominally at 5.0 V. If an external reference buffer is used to achieve the maximum
SNR performance with a 5 V reference, the reference buffer must be powered down by connecting the
REFIN pin to ground. The external reference buffer must be connected to the BVDD pin.
20
REFIN
AI/O
Internal Reference Output/Reference Buffer Input.
When PDREF is low, the internal band gap reference produces a 1.2 V (typical) voltage on this pin,
which needs external decoupling (0.1 F typical).
When PDREF is high, use an external reference to provide 1.2 V (typical) to this pin.
When PDREF is high and REFIN is low, the on-chip reference buffer and the band gap reference are
powered down. An external reference must be connected to REF and BVDD.
21
Exposed Pad
EP
The exposed pad is not connected internally. For increased reliability of the solder joints, it is
recommended that the pad be soldered to the system ground plane.
1
AI = analog input, AI/O = bidirectional analog, DI = digital input, DO = digital output, and P = power.
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