TA = 25°C, unless otherwise noted" />
參數(shù)資料
型號(hào): AD7849CR
廠商: Analog Devices Inc
文件頁數(shù): 17/20頁
文件大?。?/td> 0K
描述: IC DAC 16BIT SRL INP 20-SOIC
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 1
設(shè)置時(shí)間: 7µs
位數(shù): 16
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 模擬和數(shù)字,雙 ±
功率耗散(最大): 100mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 管件
輸出數(shù)目和類型: 1 電壓,單極;1 電壓,雙極
采樣率(每秒): 143k
AD7849
Rev. C | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to DGND
0.4 V to +17 V
VCC to DGND1
0.4 V, VDD + 0.4 V or
+7 V (whichever is
lower)
VSS to DGND
0.4 V to 17 V
VREF+ to DGND
VDD + 0.4 V, VSS 0.4 V
VREF to DGND
VDD + 0.4 V, VSS 0.4 V
VOUT to DGND2
VDD + 0.4 V, VSS 0.4 V
or ±10 V (whichever is
lower)
ROFS to DGND
VDD + 0.4 V, VSS 0.4 V
Digital Input Voltage to DGND
0.4 V to VCC + 0.4 V
Input Current to any Pin Except Supplies3
±10 mA
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
20-Lead PDIP
Power Dissipation
875 mW
θJA Thermal Impedance
102°C/W
Lead Temperature (Soldering, 10 sec)
260°C
20-Lead SOIC
Power Dissipation
875 mW
θJA Thermal Impedance
74°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 VCC must not exceed VDD by more than 0.4 V. If it is possible for this to
happen during power-up or power-down (for example, if VCC is greater than
0.4 V while VDD is still 0 V), the following diode protection scheme ensures
protection.
SD103C
1N5711
1N5712
1N4148
VDD
VCC
VDD
VCC
AD7849
0100
8-0
02
2 VOUT can be shorted to DGND, + 10 V, 10 V, provided that the power
dissipation of the package is not exceeded.
3 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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