DD to DGND . . . . . . . . . . . . . . . . . . . . . . ." />
參數(shù)資料
型號(hào): AD7812YR
廠商: Analog Devices Inc
文件頁數(shù): 19/24頁
文件大?。?/td> 0K
描述: IC ADC 10BIT 8-CHAN SRL 20-SOIC
產(chǎn)品變化通告: Product Discontinuance 27/Oct/2011
標(biāo)準(zhǔn)包裝: 37
位數(shù): 10
采樣率(每秒): 350k
數(shù)據(jù)接口: DSP,串行
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 10.5mW
電壓電源: 單電源
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 管件
輸入數(shù)目和類型: 8 個(gè)單端,單極;7 偽差分,單極
AD7811/AD7812
–4–
REV. B
ABSOLUTE MAXIMUM RATINGS
V
DD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to DGND (
CONVST, SCLK, RFS, TFS,
DIN, A0) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Digital Output Voltage to DGND (DOUT)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
REFIN to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Analog Inputs
VIN1–VIN4 (AD7811) . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VIN1–VIN8 (AD7812) . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . . . 260
°C
ORDERING GUIDE
Linearity
Package
Model
Error
Descriptions
Options
AD7811YN
±1 LSB
16-Lead Plastic DIP
N-16
AD7811YR
±1 LSB
16-Lead Small Outline IC (SOIC)
R-16A
AD7811YRU
±1 LSB
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD7812YN
±1 LSB
20-Lead Plastic DIP
N-20
AD7812YR
±1 LSB
20-Lead Small Outline IC (SOIC)
R-20A
AD7812YRU
±1 LSB
20-Lead Thin Shrink Small Outline Package (TSSOP)
RU-20
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 115°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7811/AD7812 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Z
1
Z
C
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